Film forming method and film forming apparatus

A film forming method for forming a film including an alloy film on a surface of a substrate using a film forming target made of the alloy film, wherein the alloy film contains multiple kinds of elements including a first element, the film forming method comprising steps of:

• (a) arranging the film forming target and a distribution improvement target to face the substrate;
• and
• (b) forming the film on the substrate by simultaneously or alternately sputtering the film forming target and the distribution improvement target,
• wherein the distribution improvement target is made of a distribution improvement film containing the first element, wherein the first element is a metal element and is non-uniformly distributed on the surface of the substrate, among the multiple kinds of elements, when the film is formed on the substrate by the film forming target,
• in the step (b), a larger amount of the first element sputtered from the distribution improvement target is supplied to an outer periphery portion of the substrate where a distribution amount of the first element sputtered from the film forming target is less than other portions of the substrate when the film is formed on the substrate by sputtering the film forming target, and
• the step (b) includes:
• moving a magnet disposed on a side of the film forming target opposite to the substrate in a longitudinal direction of the film forming target, and
• controlling a power supply, which supplies a power to a holder configured to hold the film forming target, to supply a first power to the holder when the magnet is located at an edge of the film forming target in the longitudinal direction and a second power to the holder when the magnet is located at a center of the film forming target to supply a larger amount of the first element to the outer periphery portion of the substrate, wherein a ratio of the second power to the first power is 0.5.