H01J 37/347
Thickness uniformity of coated layers or desired profile of target erosion
Official title: {Thickness uniformity of coated layers or desired profile of target erosion}
H01J37/347 (Thickness uniformity of coated layers or desired profile of target erosion) appears on 160 US grants and 191 published applications in this corpus.
Search patents in H01J- Granted patents
- 160
- Published applications
- 191
- Assignees
- 93
- Inventors
- 409
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 2 |
| 2003 | 1 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 3 |
| 2008 | 1 | 4 |
| 2009 | 2 | 3 |
| 2010 | 1 | 7 |
| 2011 | 0 | 7 |
| 2012 | 2 | 5 |
| 2013 | 6 | 8 |
| 2014 | 3 | 7 |
| 2015 | 5 | 10 |
| 2016 | 5 | 14 |
| 2017 | 11 | 21 |
| 2018 | 12 | 12 |
| 2019 | 11 | 14 |
| 2020 | 12 | 14 |
| 2021 | 6 | 8 |
| 2022 | 12 | 12 |
| 2023 | 8 | 14 |
| 2024 | 14 | 11 |
| 2025 | 11 | 7 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Erosion rate monitoring for wafer fabrication equipment11 Aug 2026US 12,706,281 B2Micron Technology, Inc.
- Wafer edge profile control using connected edge ring hardware14 Jul 2026US 12,683,136 B2APPLIED Materials.Inc.
- Thin film forming apparatus and method16 Jun 2026US 12,658,415 B2Semes Co., Ltd.
- Wafer edge profile control using connected edge ring hardware26 May 2026US 12,640,353 B2APPLIED Materials.Inc.
- Sputtering apparatus17 Mar 2026US 12,580,168 B2Canon Anelva Corporation
- Wafer edge profile control using connected edge ring hardware24 Sep 2026US 2026/0290771 A1APPLIED Materials.Inc.
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate28 May 2026US 2026/0146315 A1APPLIED Materials.Inc.
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus2 Apr 2026US 2026/0094796 A1Samsung Electronics Co., Ltd.
- System and Method for Atomic Layer Etching with Uniformity Control Mechanisms26 Mar 2026US 2026/0088251 A1Inspiring Atoms Pte Ltd
Most cited
By later US patents
- Stationary aperture plate for reactive sputter deposition566US 5,415,753 AMaterials Research Corporation · 1995
- Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source127US 5,556,521 AMaterials Research Corporation · 1996
- Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity101US 5,320,728 AAPPLIED Materials.Inc. · 1994
- Planar magnetron sputtering method and apparatus67US 3,956,093 AAirco, Inc. · 1976
- Methods and apparatus for sputtering with rotating magnet sputter sources62US 5,830,327 AIntevac, Inc. · 1998