H01J 37/3402
Using supplementary magnetic fields
Official title: {using supplementary magnetic fields}
H01J37/3402 (Using supplementary magnetic fields) appears on 1,632 US grants and 1,661 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,632
- Published applications
- 1,661
- Assignees
- 624
- Inventors
- 3,198
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 7 | 0 |
| 1978 | 8 | 0 |
| 1979 | 10 | 0 |
| 1980 | 8 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 22 | 0 |
| 1984 | 28 | 0 |
| 1985 | 16 | 0 |
| 1986 | 21 | 0 |
| 1987 | 10 | 0 |
| 1988 | 14 | 0 |
| 1989 | 25 | 0 |
| 1990 | 20 | 0 |
| 1991 | 19 | 0 |
| 1992 | 29 | 0 |
| 1993 | 30 | 0 |
| 1994 | 34 | 0 |
| 1995 | 27 | 0 |
| 1996 | 32 | 0 |
| 1997 | 29 | 0 |
| 1998 | 31 | 0 |
| 1999 | 34 | 0 |
| 2000 | 50 | 0 |
| 2001 | 61 | 18 |
| 2002 | 75 | 45 |
| 2003 | 37 | 50 |
| 2004 | 59 | 71 |
| 2005 | 29 | 64 |
| 2006 | 17 | 77 |
| 2007 | 17 | 77 |
| 2008 | 13 | 64 |
| 2009 | 23 | 75 |
| 2010 | 29 | 81 |
| 2011 | 32 | 80 |
| 2012 | 36 | 73 |
| 2013 | 47 | 79 |
| 2014 | 50 | 92 |
| 2015 | 49 | 87 |
| 2016 | 55 | 73 |
| 2017 | 69 | 79 |
| 2018 | 61 | 64 |
| 2019 | 42 | 52 |
| 2020 | 41 | 58 |
| 2021 | 41 | 61 |
| 2022 | 55 | 76 |
| 2023 | 46 | 58 |
| 2024 | 51 | 51 |
| 2025 | 52 | 26 |
| 2026 | 27 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Tubular sputter cathode29 Sep 2026US 12,747,491 B2BüHler Alzenau GmbH
- Magnetron sputtering apparatus29 Sep 2026US 12,747,493 B2Daegu Gyeongbuk Institute of Science and Technology
- Permeance magnetic assembly15 Sep 2026US 12,738,468 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sputtering machines, substrate holders, and sputtering processes with magnetic biasing23 Jun 2026US 12,662,731 B2Virginia Commonwealth University
- Online adjustment of magnet bars in magnetrons1 Oct 2026US 2026/0302147 A1Soleras Advanced Coatings BV
- Sputtering apparatus24 Sep 2026US 2026/0290772 A1Tokyo Electron Limited
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Semiconductor process chamber and semiconductor process equipment30 Jul 2026US 2026/0218372 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Apparatus For Depositing Material Layers on a Substrate23 Jul 2026US 2026/0209932 A1
Most cited
By later US patents
- Apparatus and method for high throughput sputtering366US 5,683,561 AConner Peripherals, Inc. · 1997
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Inductive plasma loop enhancing magnetron sputtering272US 6,679,981 B1APPLIED Materials.Inc. · 2004
- Embedded plasma source for plasma density improvement266US 6,446,572 B1Tokyo Electron Limited · 2002
- Sputtering system using cylindrical rotating magnetron electrically powered using alternating current260US 5,814,195 AThe BOC Group, Inc. · 1998