Tubular sputter cathode
AssigneeBüHler Alzenau GmbH
InventorsJens-Peter Biethan, Martin Stapp, Harro Hagedorn
Life of this patent
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Abstract
A magnetron sputtering system including a substrate to be coated and a magnetron sputtering device including at least one rotatable tubular cathode, a mask positioned between the cathode and the substrate and at least one magnet. The magnet is tiltably supported inside the tubular cathode. The system further includes a controller, wherein the controller is configured to control a tilt of the at least one magnet and/or a tilt of the at least one rotatable tubular cathode with respect to the substrate to be coated for tuning coating uniformity on the substrate.
Claims17
A magnetron sputtering system comprising:
- a substrate to be coated,
- a magnetron sputtering device comprising:
- at least one rotatable tubular cathode,
- a mask positioned between the at least one rotatable tubular cathode and the substrate, and
- at least one magnet, wherein the at least one magnet is tiltably supported inside the at least one rotatable tubular cathode,
- a measuring means configured to iteratively perform measurement of a layer thickness distribution on the substrate, and
- a controller configured to control a tilt of the at least one magnet and a tilt of the at least one rotatable tubular cathode with respect to the substrate to be coated for tuning coating uniformity on the substrate to be coated based upon the measured layer thickness distribution.
A magnetron sputtering system comprising:
- a substrate to be coated,
- a magnetron sputtering device comprising:
- at least one rotatable tubular cathode,
- a mask positioned between the at least one rotatable tubular cathode and the substrate, and
- at least one magnet, wherein the at least one magnet is tiltably supported inside the at least one rotatable tubular cathode,
- a measuring means configured to measure a layer thickness distribution on the substrate, and
- a controller configured to control a tilt of the at least one rotatable tubular cathode with respect to the substrate to be coated for tuning coating uniformity on the substrate to be coated based upon the measured layer thickness distribution.
A method for controlling a layer thickness distribution on a substrate to be coated in a magnetron sputtering system, the magnetron sputtering system comprising:
- at least one rotatable tubular cathode, a substrate to be coated, a mask positioned between the at least one rotatable tubular cathode and the substrate, and at least one magnet, wherein the at least one magnet is tiltably supported inside the at least one rotatable tubular cathode;
- the method comprising:
- iteratively measuring a layer thickness distribution of the substrate to be coated, and
- controlling a tilt of the at least one magnet and a tilt of the at least one rotatable tubular cathode with respect to the substrate to be coated to tune coating uniformity on the substrate to be coated based upon the measured layer thickness distribution.
Dependencies are inferred from the claim text.