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US 12,738,468 B2Granted
Permeance magnetic assembly
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Jen Yang, Yi-Zhen Chen, Chih-Pin Wang, Chao-Li Shih, Ching-Hou Su, Cheng-Yi Huang
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Abstract
In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.
Claims20
A semiconductor processing chamber, comprising:
- an inner permeance annulus within the semiconductor processing chamber;
- and
- an outer permeance annulus connected to the inner permeance annulus via magnets within the semiconductor processing chamber, wherein:
- the outer permeance annulus comprises a peak region having a width greater than other regions of the outer permeance annulus, and
- the outer permeance annulus comprises (a) a main structure that is a single continuous piece and (b) a permeance extension structure that is a separate piece from the main structure.
2 more elements
A semiconductor processing chamber, comprising:
- a magnetic assembly comprising:
- an inner permeance annulus
- within the semiconductor processing chamber;
- and
- an outer permeance annulus connected to the inner permeance annulus via magnets within the semiconductor processing chamber, wherein:
- the outer permeance annulus comprises (a) a main structure that is a single continuous piece and (b) a permeance extension structure that is a separate piece from the main structure, the main structure comprises a peak region having a tip that extends more toward the inner permeance annulus than other regions of the main structure of the outer permeance annulus.
3 more elements
A semiconductor processing chamber, comprising:
- a magnetic assembly comprising:
- an inner permeance annulus
- within the semiconductor processing chamber;
- an outer permeance annulus connected to the inner permeance annulus via magnets within the semiconductor processing chamber, wherein:
- the outer permeance annulus comprises (a) a main structure that is a single continuous piece and (b) a permeance extension structure that is a separate piece from the main structure, the main structure comprises a peak region with a concave feature and a convex feature, and the permeance extension structure is adhered to the peak region of the main structure of the outer permeance annulus via an adhesive material.
2 more elements
Dependencies are inferred from the claim text.