Sputtering apparatus
AssigneeTokyo Electron Limited
InventorsHiromu INOUE, Naoya FUKUDA
Life of this patent
Estimating the term…
Abstract
A sputtering apparatus includes: a processing container; a substrate stage configured to place a substrate thereon inside the processing container; a cathode unit having a target disposed above the substrate; a radio-frequency power supply configured to supply radio-frequency power to the target; a magnet unit including a magnet fixing portion provided on a rear side of the target to fix a magnet, and a rocking drive configured to move the magnet fixing portion; and a covering member configured to cover a rear side of the cathode unit and a rear side of the magnet fixing portion, wherein the rocking drive includes a motor disposed outside the covering member and configured to rock the magnet fixing portion.
Claims11
A sputtering apparatus, comprising:
- a processing container;
- a substrate stage configured to place a substrate thereon inside the processing container;
- a cathode unit having a target disposed above the substrate;
- a radio-frequency power supply configured to supply radio-frequency power to the target;
- a magnet unit including a magnet fixing portion provided on a rear side of the target to fix a magnet, and a rocking drive configured to move the magnet fixing portion;
- and
- a covering member configured to cover a rear side of the cathode unit and a rear side of the magnet fixing portion,
- wherein the rocking drive includes a motor disposed outside the covering member and configured to rock the magnet fixing portion.
Dependencies are inferred from the claim text.