H01J 37/3476
Testing and control
Official title: {Testing and control}
H01J37/3476 (Testing and control) appears on 167 US grants and 240 published applications in this corpus.
Search patents in H01J- Granted patents
- 167
- Published applications
- 240
- Assignees
- 93
- Inventors
- 452
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 2 | 3 |
| 2005 | 4 | 6 |
| 2006 | 1 | 3 |
| 2007 | 1 | 4 |
| 2008 | 0 | 1 |
| 2009 | 3 | 3 |
| 2010 | 1 | 5 |
| 2011 | 1 | 3 |
| 2012 | 2 | 7 |
| 2013 | 1 | 10 |
| 2014 | 6 | 11 |
| 2015 | 7 | 10 |
| 2016 | 7 | 27 |
| 2017 | 8 | 21 |
| 2018 | 11 | 19 |
| 2019 | 16 | 9 |
| 2020 | 13 | 12 |
| 2021 | 11 | 12 |
| 2022 | 4 | 17 |
| 2023 | 13 | 18 |
| 2024 | 19 | 17 |
| 2025 | 20 | 12 |
| 2026 | 11 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Real-time detection of particulate matter during deposition chamber manufacturing15 Sep 2026US 12,738,467 B2APPLIED Materials.Inc.
- Film formation apparatus and film formation method of gallium nitride film11 Aug 2026US 12,703,910 B2Japan Display Inc.
- Film formation apparatus28 Jul 2026US 12,692,590 B2Japan Display Inc.
- Magnetron sputtering apparatus and control method for timely detecting target shorting by monitoring electrical resistance between PVD target cathode and electrical ground in real time23 Jun 2026US 12,662,732 B2Arrayed Materials (China) Co., Ltd.
- Thin film forming apparatus and method16 Jun 2026US 12,658,415 B2Semes Co., Ltd.
- Real-time detection of particulate matter during deposition chamber manufacturing24 Sep 2026US 2026/0290768 A1APPLIED Materials.Inc.
- Method for Improving Deposition Process16 Jul 2026US 2026/0204528 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor processing tool and methods of operation2 Jul 2026US 2026/0188632 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method, control device, computer program and storage medium30 Apr 2026US 2026/0117367 A1Von Ardenne Asset GmbH & Co. KG
- System for target arcing mapping and plasma diagnosis30 Apr 2026US 2026/0121005 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Rate enhanced pulsed DC sputtering system79US 9,812,305 B2Advanced Energy Industries, Inc. · 2017
- Systems and methods for single magnetron sputtering72US 10,373,811 B2AES Global Holdings PTE Ltd. · 2019
- Defect-mitigation layers in electrochromic devices70US 9,007,674 B2View, Inc. · 2015
- Method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes68US 10,332,730 B2AES Global Holdings PTE Ltd. · 2019
- System and method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes62US 9,711,335 B2Advanced Energy Industries, Inc. · 2017