Sputtering Components, Inc.
Owatonna, MN, US· latest recorded location
Sputtering Components, Inc. is named on 12 US grants and 18 published applications in this corpus. Its most frequent classification is H01J (Electric discharge tubes or discharge lamps).
- Granted patents
- 12
- Published applications
- 18
- Inventors
- 12
- Granted in 2026 so far
- 0
- Most recent grant
- 28 Jul 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 2 |
| 2005 | 2 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 2 |
| 2012 | 1 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 5 |
| 2015 | 1 | 1 |
| 2016 | 4 | 2 |
| 2017 | 2 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year.
Technology areas
Share of 30 documents
Recent patents
- Magnetic force release for sputtering sources with magnetic target materials28 Jul 2020US 10,727,034 B2
- Sputtering apparatus7 Nov 2017US RE46,599 E1
- Sputtering apparatus12 Sep 2017US 9,758,862 B2
- Sputtering apparatus16 Aug 2016US 9,418,823 B2
- Plasma enhanced chemical vapor deposition (PECVD) source2 Aug 2016US 9,406,487 B2
- Rf sputtering of multiple electrodes with optimized plamsa coupling through the implementation of capacitive and inductive components13 Feb 2025US 2025/0054728 A1
- Magnetic force release for sputtering sources with magnetic target materials21 Feb 2019US 2019/0057848 A1
- Dual power feed rotary sputtering cathode28 Sep 2017US 2017/0278685 A1
- Sputtering apparatus4 Aug 2016US 2016/0225591 A1
- Ion control for a plasma source3 Mar 2016US 2016/0064191 A1
Most cited
By later US patents