H01J 37/3479
Detecting exhaustion of target material
Official title: {Detecting exhaustion of target material}
H01J37/3479 (Detecting exhaustion of target material) appears on 21 US grants and 27 published applications in this corpus.
Search patents in H01J- Granted patents
- 21
- Published applications
- 27
- Assignees
- 13
- Inventors
- 54
- Latest grant
- 17 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 3 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 3 |
| 2015 | 0 | 2 |
| 2016 | 2 | 4 |
| 2017 | 2 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 1 |
| 2020 | 2 | 1 |
| 2021 | 2 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 2 |
| 2024 | 3 | 2 |
| 2025 | 1 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Physical vapor deposition (PVD) with target erosion profile monitoring17 Jun 2025US 12,334,319 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Physical vapor deposition process apparatus and method of optimizing thickness of a target material film deposited using the same10 Dec 2024US 12,165,935 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Film forming method, film forming apparatus, and program17 Sep 2024US 12,094,700 B2Tokyo Electron Limited
- Film forming apparatus and film forming method6 Feb 2024US 11,894,222 B2Tokyo Electron Limited
- Apparatus for fabricating a semiconductor device with target sputtering and target sputtering method for fabricating the semiconductor device3 Aug 2021US 11,081,341 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Physical vapor deposition (pvd) with target erosion profile monitoring25 Sep 2025US 2025/0299938 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of manufacturing semiconductor device and sputtering chambers20 Feb 2025US 2025/0062165 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Physical vapor deposition (pvd) with target erosion profile monitoring26 Dec 2024US 2024/0429036 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bias magnetic field control method, control device, and semiconductor process equipment13 Jun 2024US 2024/0191340 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Physical vapor deposition process apparatus and method of optimizing thickness of a target material film deposited using the same2 Mar 2023US 2023/0067466 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes68US 10,332,730 B2AES Global Holdings PTE Ltd. · 2019
- System and method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes62US 9,711,335 B2Advanced Energy Industries, Inc. · 2017
- Magnetron sputter coating source for both magnetic and non magnetic target materials45US 4,500,409 AVarian Associates, Inc. · 1985
- Cathodic sputtering target including means for detecting target piercing39US 4,374,722 ABattelle Development Corporation · 1983
- Deposition rate regulation by computer control of sputtering systems35US 4,166,783 AVarian Associates, Inc. · 1979