Physical vapor deposition (PVD) with target erosion profile monitoring
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hsi Wang, Yen-Yu Chen
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hsi Wang, Yen-Yu Chen
Estimating the term…
A physical vapor deposition (PVD) system includes: a chamber body; a substrate support disposed within the chamber body and capable of supporting a substrate; a PVD target; and a target profile monitoring subsystem. The PVD target includes: a target plate comprising a target material; and a backing plate attached to the target plate and comprising: a central section; and a peripheral section circumferentially surrounding the central section in a horizontal plane. The peripheral section has a first thickness in a vertical direction, the central section has a second thickness in the vertical direction, and the first thickness is larger than the second thickness. The target profile monitoring subsystem is configured to monitor usage of the target plate.
A physical vapor deposition (PVD) system comprising:
A method comprising:
A physical vapor deposition (PVD) target comprising:
Dependencies are inferred from the claim text.