H01J 37/3482
Detecting or avoiding eroding through
Official title: {Detecting or avoiding eroding through}
H01J37/3482 (Detecting or avoiding eroding through) appears on 33 US grants and 39 published applications in this corpus.
Search patents in H01J- Granted patents
- 33
- Published applications
- 39
- Assignees
- 18
- Inventors
- 84
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 2 | 2 |
| 2005 | 2 | 3 |
| 2006 | 1 | 2 |
| 2007 | 1 | 4 |
| 2008 | 0 | 1 |
| 2009 | 2 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 2 | 4 |
| 2013 | 1 | 3 |
| 2014 | 4 | 2 |
| 2015 | 1 | 0 |
| 2016 | 1 | 3 |
| 2017 | 1 | 0 |
| 2018 | 2 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 2 |
| 2021 | 2 | 0 |
| 2022 | 0 | 4 |
| 2023 | 1 | 1 |
| 2024 | 4 | 0 |
| 2025 | 1 | 2 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Film forming apparatus and film forming method24 Feb 2026US 12,559,835 B2Tokyo Electron Limited
- Support unit, apparatus for treating substrate with the same4 Nov 2025US 12,463,020 B2Semes Co., Ltd.
- Film forming apparatus and film forming method10 Dec 2024US 12,163,215 B2Tokyo Electron Limited
- Target, film forming apparatus, and method of manufacturing film formation object22 Oct 2024US 12,125,690 B2Jsw Afty Corporation
- Film forming method, film forming apparatus, and program17 Sep 2024US 12,094,700 B2Tokyo Electron Limited
- Magnetron Sputtering Apparatus and Control Method for Timely Detecting Target Shorting by Monitoring Electrical Resistance Between PVD Target Cathode and Electrical Ground in Real Time2 Oct 2025US 2025/0305114 A1Arrayed Materials (China) Co., Ltd.
- Film forming apparatus and film forming method20 Feb 2025US 2025/0059640 A1Tokyo Electron Limited
- Support unit, apparatus for treating substrate with the same and method for treating substrate with the same2 Feb 2023US 2023/0030464 A1Semes Co., Ltd.
- Film forming apparatus and film forming method9 Jun 2022US 2022/0178014 A1Tokyo Electron Limited
- System and method for detecting abnormality of thin-film deposition process19 May 2022US 2022/0154330 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Target and method of optimizing target profile24US 6,872,284 B2Tosoh SMD, Inc. · 2005
- High purity sputter targets with target end-of-life indication and method of manufacture18US 7,063,773 B2Tosoh SMD, Inc. · 2006
- Device for measuring the profile of a metal film sputter deposition target, and system and method employing same13US 6,811,657 B2Micron Technology, Inc. · 2004
- PVD target with end of service life detection capability5US 7,891,536 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2011
- Method and means for enhancing utilization of sputtering targets4US 6,702,930 B1Seagate Technology LLC · 2004