Method and means for enhancing utilization of sputtering targets

Abstract

A method of sputtering a target, comprising steps of: (a) providing a magnetically enhanced sputtering apparatus comprising a sputtering target having a first, sputtering surface and a second, opposing surface in electrical contact with a cathode electrode of the sputtering apparatus; (b) sputtering the first surface of the target to form a first erosion track therein; (c) removing the target from the sputtering apparatus when the first erosion track reaches a predetermined depth below the first surface; (d) reinstalling the sputtering target in the sputtering apparatus such that the second surface is the sputtering surface and the first surface is the opposing surface and is in electrical contact with the cathode via an intervening backing plate comprised of at least one material selected for causing a second erosion track to be formed in the second surface of the target during sputtering therefrom which is laterally displaced from the first erosion track; and (e) sputtering the second surface of the target to form the laterally displaced second erosion track therein to a predetermined depth below the second surface, thereby increasing the utilization of the sputtering target.

Dependencies are inferred from the claim text.