Device for measuring the profile of a metal film sputter deposition target, and system and method employing same

A method for profiling a sputtering target surface, the method comprising:

• selectively positioning a sensor relative to a first location of the target surface;
• emitting an energy beam from the sensor;
• illuminating the first location with the emitted energy beam;
• detecting a reflection of the energy beam from the first location;
• analyzing the detected reflection of the energy beam to determine a distance from the sensor to the first location;
• and
• selectively positioning the sensor relative to a second location of the target surface.

A sputter deposition system comprising:

• sensor circuitry configured to emit an energy beam toward a target surface and to detect a reflection of the energy beam from the target surface;
• an arm configured to attach to at least a portion of the sensor circuitry, the arm configured to transport the at least a portion of the sensor circuitry relative to the target surface;
• and
• a controller electrically coupled to the sensor circuitry, the controller configured to determine a distance from the at least a portion of the sensor circuitry to the target surface.