H01J 37/3444
Associated circuits
Official title: {Associated circuits}
H01J37/3444 (Associated circuits) appears on 190 US grants and 212 published applications in this corpus.
Search patents in H01J- Granted patents
- 190
- Published applications
- 212
- Assignees
- 114
- Inventors
- 460
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 3 |
| 2002 | 7 | 5 |
| 2003 | 7 | 2 |
| 2004 | 4 | 7 |
| 2005 | 2 | 5 |
| 2006 | 0 | 4 |
| 2007 | 4 | 7 |
| 2008 | 0 | 9 |
| 2009 | 3 | 7 |
| 2010 | 2 | 18 |
| 2011 | 5 | 16 |
| 2012 | 4 | 9 |
| 2013 | 9 | 13 |
| 2014 | 4 | 11 |
| 2015 | 15 | 5 |
| 2016 | 10 | 18 |
| 2017 | 12 | 9 |
| 2018 | 9 | 13 |
| 2019 | 9 | 6 |
| 2020 | 12 | 8 |
| 2021 | 10 | 10 |
| 2022 | 6 | 9 |
| 2023 | 4 | 9 |
| 2024 | 6 | 3 |
| 2025 | 7 | 2 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated7 Apr 2026US 12,595,550 B2Evatec AG
- Plasma process apparatus17 Feb 2026US 12,555,744 B2Samsung Electronics Co., Ltd.
- Rate enhanced pulsed DC sputtering system2 Sep 2025US 12,406,838 B2Advanced Energy Industries, Inc.
- RF sputtering of multiple electrodes with optimized plasma coupling through the implementation of capacitive and inductive components26 Aug 2025US 12,400,830 B2Advanced Energy Industries, Inc.
- Magnetic field control system12 Aug 2025US 12,387,916 B2Lam Research Corporation
- Online adjustment of magnet bars in magnetrons1 Oct 2026US 2026/0302147 A1Soleras Advanced Coatings BV
- Substrate processing apparatus2 Apr 2026US 2026/0094796 A1Samsung Electronics Co., Ltd.
- Pulsed power module with pulse and ion flux control for magnetron sputtering5 Feb 2026US 2026/0038783 A1Starfire Industries LLC
- Method of operating a plasma process system and a plasma process system22 Jan 2026US 2026/0022450 A1
- Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated12 Jun 2025US 2025/0188594 A1Evatec AG
Most cited
By later US patents
- Sputtering system using cylindrical rotating magnetron electrically powered using alternating current260US 5,814,195 AThe BOC Group, Inc. · 1998
- Method of and apparatus for sputtering149US 4,999,096 AHitachi, Ltd. · 1991
- Preferential sputtering of insulators from conductive targets111US 5,651,865 AENI S.p.A. · 1997
- Pulsed sputtering with a small rotating magnetron99US 6,413,382 B1APPLIED Materials.Inc. · 2002
- Preferential sputtering of insulators from conductive targets91US 5,810,982 AENI Technologies, Inc. · 1998