Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated
AssigneeEvatec AG
InventorJürgen Weichart
Life of this patent
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AssigneeEvatec AG
InventorJürgen Weichart
Estimating the term…
A vacuum layer deposition apparatus includes a vacuum coating chamber with an inner space; a material source to generate electrically positively charged particles of a material to be deposited on a substrate in said inner space; a substrate holder with an extended metal or dielectric material surface exposed to said inner space; and a Rf plasma source comprising: first and second electrodes Rf-connectable or Rf-connected to first and second taps of a Rf generator, respectively. Said first and second electrodes include first and second electrode surfaces, respectively, of metal or of a dielectric material which are freely exposed to said inner space. Said extended surface of said substrate holder is at least a part of said first electrode surface and said second electrode surface is larger than said first electrode surface by at least a factor of 1.5. A method includes vacuum-process depositing a layer on a substrate.
A vacuum layer deposition apparatus comprising
A method of vacuum-process depositing a layer on a substrate, or of manufacturing such substrates coated with a vacuum-process deposited layer, comprising:
Dependencies are inferred from the claim text.