H01J 37/345
Magnet arrangements in particular for cathodic sputtering apparatus
Official title: {Magnet arrangements in particular for cathodic sputtering apparatus (material of magnets or magnets in general H01F1/00, H01F7/00)}
H01J37/345 (Magnet arrangements in particular for cathodic sputtering apparatus) appears on 628 US grants and 754 published applications in this corpus.
Search patents in H01J- Granted patents
- 628
- Published applications
- 754
- Assignees
- 249
- Inventors
- 1,397
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 9 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 10 | 0 |
| 1993 | 15 | 0 |
| 1994 | 15 | 0 |
| 1995 | 9 | 0 |
| 1996 | 9 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 12 | 0 |
| 2000 | 6 | 0 |
| 2001 | 15 | 6 |
| 2002 | 18 | 6 |
| 2003 | 4 | 10 |
| 2004 | 12 | 17 |
| 2005 | 6 | 23 |
| 2006 | 9 | 21 |
| 2007 | 3 | 25 |
| 2008 | 5 | 25 |
| 2009 | 10 | 28 |
| 2010 | 10 | 34 |
| 2011 | 9 | 38 |
| 2012 | 16 | 34 |
| 2013 | 28 | 37 |
| 2014 | 22 | 44 |
| 2015 | 21 | 35 |
| 2016 | 27 | 37 |
| 2017 | 32 | 36 |
| 2018 | 22 | 35 |
| 2019 | 21 | 36 |
| 2020 | 30 | 27 |
| 2021 | 23 | 38 |
| 2022 | 35 | 50 |
| 2023 | 27 | 43 |
| 2024 | 31 | 27 |
| 2025 | 36 | 21 |
| 2026 | 19 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Tubular sputter cathode29 Sep 2026US 12,747,491 B2BüHler Alzenau GmbH
- Magnetron sputtering apparatus29 Sep 2026US 12,747,493 B2Daegu Gyeongbuk Institute of Science and Technology
- Sputtering apparatus29 Sep 2026US 12,749,665 B2Samsung Display Co., Ltd.
- Permeance magnetic assembly15 Sep 2026US 12,738,468 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Film forming method and film forming apparatus8 Sep 2026US 12,729,426 B2Tokyo Electron Limited
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma processing apparatus1 Oct 2026US 2026/0302148 A1Ulvac, Inc.
- Sputtering apparatus24 Sep 2026US 2026/0290772 A1Tokyo Electron Limited
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Semiconductor process chamber and semiconductor process equipment30 Jul 2026US 2026/0218372 A1Beijing Naura Microelectronics Equipment Co., Ltd.
Most cited
By later US patents
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Integrated process for copper via filling using a magnetron and target producing highly energetic ions197US 6,277,249 B1APPLIED Materials.Inc. · 2001
- Magnetron and target producing an extended plasma region in a sputter reactor183US 6,251,242 B1APPLIED Materials.Inc. · 2001
- Sputtering process and apparatus180US 4,166,018 AAirco, Inc. · 1979
- Sputter coating process control method and apparatus156US 5,126,028 AMaterials Research Corporation · 1992