H01J 37/3452
Magnet distribution
Official title: {Magnet distribution}
H01J37/3452 (Magnet distribution) appears on 234 US grants and 309 published applications in this corpus.
Search patents in H01J- Granted patents
- 234
- Published applications
- 309
- Assignees
- 127
- Inventors
- 632
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 3 |
| 2002 | 7 | 2 |
| 2003 | 0 | 3 |
| 2004 | 5 | 1 |
| 2005 | 0 | 3 |
| 2006 | 1 | 4 |
| 2007 | 0 | 7 |
| 2008 | 0 | 10 |
| 2009 | 1 | 8 |
| 2010 | 3 | 15 |
| 2011 | 3 | 17 |
| 2012 | 5 | 18 |
| 2013 | 8 | 21 |
| 2014 | 13 | 20 |
| 2015 | 11 | 21 |
| 2016 | 12 | 17 |
| 2017 | 16 | 17 |
| 2018 | 9 | 18 |
| 2019 | 13 | 15 |
| 2020 | 10 | 13 |
| 2021 | 12 | 15 |
| 2022 | 15 | 15 |
| 2023 | 10 | 16 |
| 2024 | 15 | 12 |
| 2025 | 15 | 6 |
| 2026 | 10 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Magnetron sputtering apparatus29 Sep 2026US 12,747,493 B2Daegu Gyeongbuk Institute of Science and Technology
- Multicathode PVD system for high aspect ratio barrier seed deposition25 Aug 2026US 12,716,125 B2APPLIED Materials.Inc.
- Deposition apparatus28 Jul 2026US 12,692,591 B2Samsung Display Co., Ltd.
- Film forming apparatus and film forming method24 Feb 2026US 12,559,835 B2Tokyo Electron Limited
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate17 Feb 2026US 12,553,124 B2APPLIED Materials.Inc.
- Plasma processing apparatus1 Oct 2026US 2026/0302148 A1Ulvac, Inc.
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Semiconductor process chamber and semiconductor process equipment30 Jul 2026US 2026/0218372 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Magnetic field generating apparatus25 Jun 2026US 2026/0179893 A1Korea Advanced Institute of Science and Technology
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate28 May 2026US 2026/0146315 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Sputter coating process control method and apparatus156US 5,126,028 AMaterials Research Corporation · 1992
- Method and apparatus for sputter coating stepped wafers90US 4,957,605 AMaterials Research Corporation · 1990
- Magnetron sputtering source for low pressure operation86US 5,593,551 AVarian Associates, Inc. · 1997
- Dual position DC magnetron assembly72US 8,137,517 B1WD Media, LLC · 2012