Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate

A magnetron sputter cathode, comprising:

• a rotary target that is rotatable around a rotation axis;
• and
• a magnet assembly that is arranged in the rotary target and comprises:
• a first magnet having a first-polarity magnet pole directed radially outwardly;
• and
• a second magnet having a second-polarity magnet pole directed radially outwardly,
• wherein the first magnet and the second magnet extend adjacent to each other along a closed path for generating a closed plasma racetrack on a surface of the rotary target with a first plasma confinement region extending parallel to the rotation axis on a first side of the magnetron sputter cathode and a second plasma confinement region extending parallel to the rotation axis on a second side of the magnetron sputter cathode opposite to the first side so that the first plasma confinement region and the second plasma confinement region are on opposite sides of the magnetron sputter cathode and face in two different directions that enclose, with respect to the first rotation axis, a first angle of 180°, and the closed plasma racetrack further comprises:
• a first curved plasma confinement region that connects the first plasma confinement region and the second plasma confinement region at a first axial end portion of the magnetron sputter cathode;
• and
• a second curved plasma confinement region that connects the first plasma confinement region and the second plasma confinement region at a second axial end portion of the magnetron sputter cathode.

A magnetron sputter cathode, comprising:

• a rotary target that is rotatable around a rotation axis;
• and
• a magnet assembly that is arranged in the rotary target and comprises:
• a first magnet having a first-polarity magnet pole directed radially outwardly;
• and
• a second magnet having a second-polarity magnet pole directed radially outwardly,
• wherein the first magnet and the second magnet extend adjacent to each other along a closed path for generating a closed plasma racetrack on a surface of the rotary target with a first plasma confinement region extending parallel to the rotation axis on a first side of the magnetron sputter cathode and a second plasma confinement region extending parallel to the rotation axis on a second side of the magnetron sputter cathode opposite to the first side so that the first plasma confinement region and the second plasma confinement region are on opposite sides of the magnetron sputter cathode and face in two different directions that enclose, with respect to the first rotation axis, a first angle of 180°, and the closed plasma racetrack is a dual side single racetrack that does not include any dual racetracks with two parallel plasma confinement regions on a same side of the magnetron sputter cathode.

A method of depositing a material on a substrate, the method comprising:

• sputtering the material from at least one magnetron sputter cathode having a first magnet assembly arranged in a first rotary target that rotates around a first rotation axis,
• wherein the first magnet assembly provides a closed plasma racetrack on a surface of the first rotary target with a first plasma confinement region extending parallel to the first rotation axis on a first side of the at least one magnetron sputter cathode and a second plasma confinement region extending parallel to the first rotation axis on a second side of the at least one magnetron sputter cathode opposite to the first side so that the first plasma confinement region and the second plasma confinement region are on opposite sides of the at least one magnetron sputter cathode and face in two different directions that enclose, with respect to the first rotation axis, a first angle of 180°, and wherein the closed plasma racetrack further comprises:
• a first curved plasma confinement region that connects the first plasma confinement region and the second plasma confinement region at a first axial end portion of the at least one magnetron sputter cathode;
• and
• a second curved plasma confinement region that connects the first plasma confinement region and the second plasma confinement region at a second axial end portion of the at least one magnetron sputter cathode.