H01J 37/3455
Movable magnets
Official title: {Movable magnets}
H01J37/3455 (Movable magnets) appears on 357 US grants and 417 published applications in this corpus.
Search patents in H01J- Granted patents
- 357
- Published applications
- 417
- Assignees
- 151
- Inventors
- 840
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 12 | 0 |
| 1994 | 8 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 2 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 4 | 0 |
| 2001 | 14 | 5 |
| 2002 | 15 | 5 |
| 2003 | 4 | 7 |
| 2004 | 8 | 16 |
| 2005 | 6 | 22 |
| 2006 | 9 | 18 |
| 2007 | 3 | 20 |
| 2008 | 5 | 16 |
| 2009 | 7 | 21 |
| 2010 | 7 | 23 |
| 2011 | 6 | 19 |
| 2012 | 9 | 16 |
| 2013 | 17 | 16 |
| 2014 | 11 | 28 |
| 2015 | 8 | 15 |
| 2016 | 13 | 16 |
| 2017 | 12 | 16 |
| 2018 | 15 | 12 |
| 2019 | 7 | 14 |
| 2020 | 11 | 12 |
| 2021 | 9 | 20 |
| 2022 | 20 | 24 |
| 2023 | 19 | 21 |
| 2024 | 14 | 15 |
| 2025 | 23 | 12 |
| 2026 | 10 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tubular sputter cathode29 Sep 2026US 12,747,491 B2BüHler Alzenau GmbH
- Sputtering apparatus29 Sep 2026US 12,749,665 B2Samsung Display Co., Ltd.
- Film forming method and film forming apparatus8 Sep 2026US 12,729,426 B2Tokyo Electron Limited
- Deposition apparatus28 Jul 2026US 12,692,591 B2Samsung Display Co., Ltd.
- Film forming apparatus and film forming method24 Feb 2026US 12,559,835 B2Tokyo Electron Limited
- Sputtering apparatus24 Sep 2026US 2026/0290772 A1Tokyo Electron Limited
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Magnetic field generating apparatus25 Jun 2026US 2026/0179893 A1Korea Advanced Institute of Science and Technology
- Semiconductor processing tool and methods of operation28 May 2026US 2026/0148947 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System for target arcing mapping and plasma diagnosis30 Apr 2026US 2026/0121005 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Integrated process for copper via filling using a magnetron and target producing highly energetic ions197US 6,277,249 B1APPLIED Materials.Inc. · 2001
- Magnetron and target producing an extended plasma region in a sputter reactor183US 6,251,242 B1APPLIED Materials.Inc. · 2001
- Integrated process for copper via filling156US 6,274,008 B1APPLIED Materials.Inc. · 2001
- Rotating sputtering apparatus for selected erosion118US 5,252,194 AVarian Associates, Inc. · 1993
- Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity101US 5,320,728 AAPPLIED Materials.Inc. · 1994