H01J 37/3438
Electrodes other than cathode
Official title: {Electrodes other than cathode}
H01J37/3438 (Electrodes other than cathode) appears on 148 US grants and 175 published applications in this corpus.
Search patents in H01J- Granted patents
- 148
- Published applications
- 175
- Assignees
- 100
- Inventors
- 463
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 8 | 0 |
| 2002 | 4 | 5 |
| 2003 | 2 | 0 |
| 2004 | 3 | 1 |
| 2005 | 1 | 2 |
| 2006 | 0 | 6 |
| 2007 | 1 | 9 |
| 2008 | 0 | 8 |
| 2009 | 0 | 6 |
| 2010 | 1 | 16 |
| 2011 | 5 | 7 |
| 2012 | 4 | 6 |
| 2013 | 4 | 6 |
| 2014 | 5 | 13 |
| 2015 | 11 | 3 |
| 2016 | 7 | 12 |
| 2017 | 8 | 10 |
| 2018 | 5 | 11 |
| 2019 | 11 | 9 |
| 2020 | 7 | 9 |
| 2021 | 6 | 13 |
| 2022 | 5 | 9 |
| 2023 | 3 | 7 |
| 2024 | 7 | 2 |
| 2025 | 5 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing crystalline material from different materials10 Feb 2026US 12,548,756 B2Dyson Technology Limited
- Deposition apparatus2 Dec 2025US 12,488,969 B2SPTS Technologies Limited
- Wafer manufacturing apparatus11 Nov 2025US 12,467,128 B1Viavi Solutions Suzhou Co., Ltd.
- Rate enhanced pulsed DC sputtering system2 Sep 2025US 12,406,838 B2Advanced Energy Industries, Inc.
- Anode for PVD processes19 Aug 2025US 12,392,024 B2Vtd Vakuumtechnik Dresden GmbH
- Wafer manufacturing apparatus5 Mar 2026US 2026/0062795 A1Viavi Solutions Suzhou Co., Ltd.
- Display panel, electronic device, sputtering device, and manufacturing method of display panel using the same22 Jan 2026US 2026/0026207 A1Samsung Display Co., Ltd.
- Delivery of configurable pulsed voltage waveforms for substrate processing23 Oct 2025US 2025/0329520 A1APPLIED Materials.Inc.
- Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films1 May 2025US 2025/0140543 A1Intel Corporation
- Actively cooled anode for sputtering processes23 Jan 2025US 2025/0029820 A1
Most cited
By later US patents
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Method and apparatus for sputtering a dielectric target or for reactive sputtering116US 4,693,805 ABOE Limited · 1987
- Sputtering device and sputtering method109US 6,077,403 AAnelva Corporation · 2000
- Wafer bias ring in a sustained self-sputtering reactor99US 5,897,752 AAPPLIED Materials.Inc. · 1999
- Magnetron deposition of ceramic oxide-superconductor thin films82US 4,842,704 A1989