Anode for PVD processes
AssigneeVtd Vakuumtechnik Dresden GmbH
InventorsWolfgang Fukarek, Martin Holzherr
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Abstract
The invention relates to the proposal of an electrode arrangement in a device for carrying out processes of physical vapor deposition that greatly reduces or even prevents the degradation of the electrode material caused by accretions. The contamination of the anode occurring in these processes due to cathodic carbon is minimized or prevented by the application of a thin adhesion-reducing coating of high electrical conductivity to the anode, which coating has poorer adhesive properties with regard to the coating material than the uncoated anode material. This coating is preferably a nitride coating, particularly preferably of TiN, applied with a coating thickness of between 0.1 μm and 3.5 μm.
Claims13
An anode, suitable for use in a physical vapor deposition process, wherein a surface of the anode is completely or partially covered with an adhesion-reducing thin coating that is electrically conductive, wherein the adhesion-reducing thin coating has a thickness of between 0.1 μm and 3.5 μm, wherein the thin adhesion-reducing coating is a ceramic nitride coating.
A device suitable for physical vapor deposition processing with an anode arrangement, the device comprising:
- a vessel capable of maintaining different process pressures within an interior of the vessel, wherein at least two electrodes are arranged in the interior of the vessel, wherein the at least two electrodes are subjectable to an electrical voltage from outside the vessel, wherein at least one of the electrodes is configured as an anode and at least one of the electrodes is configured as a cathode, wherein the anode and cathode are capable of generating an arc discharge between the cathode and the anode over a defined period of time, wherein the anode comprises an adhesion-reducing thin coating that is electrically conductive and completely or partially covers the surface of the electrode, wherein the adhesion-reducing thin coating has a thickness of between 0.1 μm and 3.5 μm.
A method for producing an anode suitable for arc physical vapor deposition (APVD) processing, the method comprising:
- polishing a surface of an electrode of the anode until the value of an average roughness of the polished surface reaches between 0.01 μm and 0.3 μm;
- applying, after the polishing, a thin coating that completely or partially covers the polished surface, wherein the thin coating is an adhesion-reducing thin coating that is electrically conductive;
- and
- polishing or leaving as-is the thin coating until an average roughness of the polished and thin-coated surface reaches a value of greater than 0.01 μΩ·m and less than 0.1 μΩ·m.
Dependencies are inferred from the claim text.