Display panel, electronic device, sputtering device, and manufacturing method of display panel using the same

A method for manufacturing a display panel, the method comprising:

• forming a circuit layer on a base layer;
• and
• forming a light emitting element disposed on the circuit layer,
• wherein the forming the circuit layer comprises:
• forming a transistor on the base layer;
• forming, on the transistor, an insulating layer having a contact hole defined therein to expose a portion of the transistor;
• and
• forming a connecting electrode electrically connected with the transistor through the contact hole,
• wherein an aspect ratio of the contact hole defined as a ratio of a depth of the contact hole to a width of the contact hole is 0.8 or more,
• wherein the connecting electrode comprises a lateral surface portion on a side surface of the insulating layer configured to define the contact hole and an upper surface portion on the insulating layer, and
• wherein a step coverage defined as a ratio of a thickness of the lateral surface portion to a thickness of the upper surface portion is 20% or more.

A sputtering device for forming a thin metal film on a target substrate having a contact hole defined therein, the sputtering device comprising:

• a deposition chamber configured to provide a deposition space;
• a support substrate configured to support the target substrate within the deposition space;
• a plasma electrode configured to face the target substrate within the deposition space;
• a source target fixed to the plasma electrode;
• and
• a power supply unit configured to supply high power to the plasma electrode,
• wherein an aspect ratio of the contact hole defined as a ratio of a depth of the contact hole to a width of the contact hole is 0.8 or more,
• wherein the thin metal film comprises a lateral surface portion on a side surface of an insulating layer configured to define the contact hole and an upper surface portion on the insulating layer, and
• wherein a step coverage defined as a ratio of a thickness of the lateral surface portion to a thickness of the upper surface portion is 20% or more.