Wafer manufacturing apparatus
AssigneeViavi Solutions Suzhou Co., Ltd.
InventorsAiling Ding, Weibin Huang, Yinxiang Xia, Markus K. Tilsch
Life of this patent
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Abstract
In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compression surface attached to the spring, wherein the compression surface includes a second angled surface matched to the first angled surface.
Claims20
A wafer holder apparatus, comprising:
- a jig structure to receive a wafer,
- wherein the jig structure includes a first angled surface with respect to a nominal coating plane;
- and
- a spring structure to compress an end of the wafer against the first angled surface,
- wherein the spring structure includes:
- a spring;
- and
- a compression surface attached to the spring,
- wherein the compression surface includes a second angled surface matched to the first angled surface, and
- wherein the wafer holder apparatus is configured to hold the wafer, such that the wafer is imparted with a pre-coating bias that is an inverse of a post-coating bias.
A method, comprising:
- disposing a wafer on a jig structure of a wafer holder apparatus,
- wherein the jig structure includes a press ring that is at least 3 millimeters (mm) in width;
- affixing the wafer to the jig structure using a spring structure of the wafer holder apparatus by compressing an end of the wafer against the press ring such that at least 3 mm of width of the wafer is in contact with the press ring;
- and
- coating one or more layers of material on the wafer,
- wherein, based on affixing the wafer to the jig structure and coating the one or more layers of material on the wafer, the wafer is imparted with a pre-coating bias that is an inverse of a post-coating bias.
A wafer holder apparatus, comprising:
- a jig structure to receive a wafer,
- wherein the jig structure includes a press ring to receive the wafer;
- and
- a spring structure to compress an end of the wafer against the press ring such that at least a threshold diameter of the wafer overlaps with the press ring,
- wherein the threshold diameter is based on an optimization of a coating surface of the wafer relative to a yield of the wafer,
- wherein the spring structure includes:
- a spring;
- and
- a compression surface attached to the spring, and
- wherein the wafer holder apparatus is configured to hold the wafer, such that the wafer is imparted with a pre-coating bias that is an inverse of a post-coating bias.
Dependencies are inferred from the claim text.