Wafer manufacturing apparatus
AssigneeViavi Solutions Suzhou Co., Ltd.
InventorsAiling DING, Weibin HUANG, Yinxiang XIA, Markus K. TILSCH
Life of this patent
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Abstract
In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compression surface attached to the spring, wherein the compression surface includes a second angled surface matched to the first angled surface.
Claims20
A wafer holder apparatus, comprising:
- a jig structure configured to receive a wafer;
- and
- a spring structure configured to compress an end of the wafer against the jig structure,
- wherein the spring structure includes:
- a spring;
- and
- a compression surface configured to be in contact with the wafer,
- wherein the compression surface has at least a threshold width.
A wafer holder apparatus, comprising:
- a jig structure comprising a press ring;
- and
- a spring structure configured to compress an end of a wafer against the press ring,
- wherein the spring structure includes a compression surface configured to be in contact with the wafer,
- wherein the compression surface has a width of at least 3 millimeters (mm).
A wafer holder apparatus, comprising:
- a jig structure comprising a first angled surface with respect to a nominal coating plane;
- and
- a spring structure comprising a compression surface,
- wherein the compression surface includes a second angled surface matched to the first angled surface, and
- wherein, when the compression surface clamps a wafer to the jig structure, the first angled surface and the second angled surface cause the wafer to be deformed.
Dependencies are inferred from the claim text.