H01J 37/3414
Targets
Official title: {Targets}
H01J37/3414 (Targets) appears on 1,266 US grants and 1,681 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,266
- Published applications
- 1,681
- Assignees
- 509
- Inventors
- 2,897
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 9 | 0 |
| 1984 | 8 | 0 |
| 1985 | 3 | 0 |
| 1986 | 10 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 14 | 0 |
| 1994 | 14 | 0 |
| 1995 | 15 | 0 |
| 1996 | 13 | 0 |
| 1997 | 9 | 0 |
| 1998 | 14 | 0 |
| 1999 | 10 | 0 |
| 2000 | 13 | 0 |
| 2001 | 27 | 8 |
| 2002 | 31 | 13 |
| 2003 | 13 | 15 |
| 2004 | 17 | 26 |
| 2005 | 9 | 23 |
| 2006 | 7 | 29 |
| 2007 | 4 | 33 |
| 2008 | 3 | 29 |
| 2009 | 5 | 44 |
| 2010 | 14 | 35 |
| 2011 | 16 | 53 |
| 2012 | 14 | 60 |
| 2013 | 27 | 75 |
| 2014 | 27 | 95 |
| 2015 | 57 | 152 |
| 2016 | 63 | 127 |
| 2017 | 98 | 149 |
| 2018 | 92 | 111 |
| 2019 | 91 | 89 |
| 2020 | 92 | 107 |
| 2021 | 70 | 96 |
| 2022 | 78 | 94 |
| 2023 | 75 | 76 |
| 2024 | 58 | 70 |
| 2025 | 71 | 45 |
| 2026 | 39 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Rotary cathode end block8 Sep 2026US 12,729,425 B2Ncs Vacuum Technology (Hefei) Co., Ltd.
- Deposition system and method1 Sep 2026US 12,727,404 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Molybdenum sputtering target assembly and method of making11 Aug 2026US 12,703,907 B2Solstice Advanced Materials US, Inc.
- Film formation apparatus and film formation method of gallium nitride film11 Aug 2026US 12,703,910 B2Japan Display Inc.
- Method for producing transparent conductive coatings for emi protection using hipims8 Oct 2026US 2026/0308745 A1Raytheon Company
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ion beam deposition system for a low resistivity metal17 Sep 2026US 2026/0275498 A1Veeco Instruments Inc.
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Pvd target structure and method for preparing the same30 Jul 2026US 2026/0218370 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Spark eliminating sputtering target and method for using and making same238US 5,922,176 ADonnelly Corporation · 1999
- Physical vapor deposition employing ion extraction from a plasma236US 5,482,611 A1996
- Sputtering of lithium229US 6,039,850 AMinnesota Mining and Manufacturing Company · 2000
- Integrated process for copper via filling using a magnetron and target producing highly energetic ions197US 6,277,249 B1APPLIED Materials.Inc. · 2001