H01J 37/3417
Arrangements
Official title: {Arrangements}
H01J37/3417 (Arrangements) appears on 277 US grants and 444 published applications in this corpus.
Search patents in H01J- Granted patents
- 277
- Published applications
- 444
- Assignees
- 164
- Inventors
- 849
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 4 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 0 | 2 |
| 2010 | 3 | 2 |
| 2011 | 2 | 14 |
| 2012 | 1 | 15 |
| 2013 | 4 | 28 |
| 2014 | 7 | 37 |
| 2015 | 14 | 39 |
| 2016 | 25 | 37 |
| 2017 | 26 | 37 |
| 2018 | 19 | 31 |
| 2019 | 23 | 29 |
| 2020 | 26 | 35 |
| 2021 | 28 | 33 |
| 2022 | 28 | 32 |
| 2023 | 24 | 23 |
| 2024 | 14 | 19 |
| 2025 | 21 | 16 |
| 2026 | 11 | 8 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Particle removal during fabrication of electrochromic devices4 Aug 2026US 12,699,296 B2View Operating Corporation
- Method for surface coating according to the sputtering principle5 May 2026US 12,618,140 B2Eltro GmbH
- Sputtering apparatus17 Mar 2026US 12,580,168 B2Canon Anelva Corporation
- Film forming apparatus and film forming method24 Feb 2026US 12,559,835 B2Tokyo Electron Limited
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate17 Feb 2026US 12,553,124 B2APPLIED Materials.Inc.
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Thin film forming device2 Jul 2026US 2026/0185211 A1Samsung Display Co., Ltd.
- Nanogranular magnetic film, magnetic core, and electronic component25 Jun 2026US 2026/0176742 A1TDK Corporation
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate28 May 2026US 2026/0146315 A1APPLIED Materials.Inc.
- Sputter target magnet14 May 2026US 2026/0132499 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes68US 10,332,730 B2AES Global Holdings PTE Ltd. · 2019
- System and method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes62US 9,711,335 B2Advanced Energy Industries, Inc. · 2017
- Methods and apparatus for applying periodic voltage using direct current59US 9,039,871 B2Advanced Energy Industries, Inc. · 2015
- Electrochromic devices42US 9,759,975 B2View, Inc. · 2017
- Electrochromic devices25US 10,599,001 B2View, Inc. · 2020