H01J 37/342
Hollow targets
Official title: {Hollow targets}
H01J37/342 (Hollow targets) appears on 139 US grants and 190 published applications in this corpus.
Search patents in H01J- Granted patents
- 139
- Published applications
- 190
- Assignees
- 115
- Inventors
- 369
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 6 | 4 |
| 2002 | 11 | 6 |
| 2003 | 2 | 3 |
| 2004 | 4 | 2 |
| 2005 | 1 | 5 |
| 2006 | 1 | 2 |
| 2007 | 1 | 7 |
| 2008 | 1 | 5 |
| 2009 | 0 | 4 |
| 2010 | 2 | 11 |
| 2011 | 2 | 8 |
| 2012 | 3 | 17 |
| 2013 | 4 | 8 |
| 2014 | 5 | 14 |
| 2015 | 7 | 6 |
| 2016 | 6 | 13 |
| 2017 | 14 | 9 |
| 2018 | 3 | 15 |
| 2019 | 6 | 7 |
| 2020 | 12 | 11 |
| 2021 | 7 | 9 |
| 2022 | 4 | 5 |
| 2023 | 4 | 7 |
| 2024 | 3 | 4 |
| 2025 | 6 | 5 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Rotary cathode end block8 Sep 2026US 12,729,425 B2Ncs Vacuum Technology (Hefei) Co., Ltd.
- Cylindrical cathode and chamber using same for sputtering3 Feb 2026US 12,542,263 B2Intevac, Inc.
- Sputtering target2 Dec 2025US 12,486,563 B2Plansee Japan Ltd.
- Rotary magnetron sputtering with individually adjustable magnetic field9 Sep 2025US 12,412,737 B2Interpane Entwicklungs-Und Beratungsgesellschaft Mbh & Co. KG
- Magnetron target coupling and support device19 Aug 2025US 12,394,610 B2Von Ardenne Asset GmbH & Co. KG
- Dynamic uniformity control for magnetron sputtering processes27 Aug 2026US 2026/0253853 A1Soleras Advanced Coatings BV
- Inverted Cylindrical Magnetron (ICM) System and Methods of Use2 Apr 2026US 2026/0094795 A1Vactronix Scientific, LLC
- Film forming apparatus and film forming method19 Feb 2026US 2026/0049390 A1
- Tubular Sputter Cathode13 Nov 2025US 2025/0346990 A1BüHler Alzenau GmbH
- Rotary magnetron sputtering with individually adjustable magnetic field9 Oct 2025US 2025/0316468 A1Interpane Entwicklungs-Und Beratungsgesellschaft Mbh & Co. KG
Most cited
By later US patents
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Physical vapor deposition employing ion extraction from a plasma236US 5,482,611 A1996
- Integrated process for copper via filling using a magnetron and target producing highly energetic ions197US 6,277,249 B1APPLIED Materials.Inc. · 2001
- Integrated process for copper via filling156US 6,274,008 B1APPLIED Materials.Inc. · 2001
- Apparatus and method for improving target erosion in hollow cathode magnetron sputter source134US 6,217,716 B1Novellus Systems, Inc. · 2001