Sputtering target

A sputtering target for producing a thin film by a sputtering method, the sputtering target comprising:

• a tubular backing tube having an axis defining an axial direction, and a radial direction plane perpendicular to the axial direction;
• at least one cylindrical target segment disposed on said tubular backing tube, said tubular backing tube extending along the axial direction through at least 90% of a total length of said at least one cylindrical target segment;
• a bonding material disposed between said tubular backing tube and said at least one cylindrical target segment, said bonding material being solder;
• a stop member, said at least one cylindrical target segment disposed adjacent said stop member, said stop member being monolithically formed with and radially protruding along said tubular backing tube at an axial end region of said tubular backing tube, and extending at least along a part of a circumference of said tubular backing tube;
• a circumferential sealing member, said at least one cylindrical target segment including an adjacent cylindrical target segment being adjacent said circumferential sealing member, said circumferential sealing member inserted between said stop member and said adjacent cylindrical target segment to prevent leakage of said bonding material;
• said circumferential sealing member being an O-ring made of an elastomeric material and compressed between said adjacent cylindrical target segment and said stop member;
• said stop member and said adjacent cylindrical target segment forming a tongue-groove-fit;
• said at least one cylindrical target segment made of a metallic material being a molybdenum-based and/or tungsten-based material;
• and
• said solder being an indium solder or an indium alloy solder.