H01J 37/3432
Target-material dispenser
Official title: {Target-material dispenser}
H01J37/3432 (Target-material dispenser) appears on 16 US grants and 17 published applications in this corpus.
Search patents in H01J- Granted patents
- 16
- Published applications
- 17
- Assignees
- 15
- Inventors
- 42
- Latest grant
- 4 Feb 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 2 | 2 |
| 2021 | 3 | 2 |
| 2022 | 3 | 2 |
| 2023 | 0 | 1 |
| 2024 | 2 | 0 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target4 Feb 2025US 12,217,948 B2Sumitomo Chemical Company, Limited
- Profiled sputtering target and method of making the same4 Feb 2025US 12,217,951 B2Honeywell International Inc.
- Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target30 Jul 2024US 12,051,577 B2Sumitomo Chemical Company, Limited
- Liquid sputter target9 Apr 2024US 11,952,654 B2Evatec AG
- System for focused deposition of atomic vapors29 Nov 2022US 11,515,131 B2The Charles Stark Draper Laboratory, Inc.
- Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target17 Apr 2025US 2025/0125131 A1Sumitomo Chemical Company, Limited
- Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target31 Aug 2023US 2023/0274921 A1Sumitomo Chemical Company, Limited
- Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target29 Sep 2022US 2022/0310371 A1Sumitomo Chemical Company, Limited
- Profiled sputtering target and method of making the same5 May 2022US 2022/0139685 A1Honeywell International Inc.
- Liquid sputter target9 Dec 2021US 2021/0381099 A1Evatec AG
Most cited
By later US patents
- Magnetron sputtering method and apparatus for compound thin films17US 5,405,517 A1995
- Insertable target holder for improved stability and performance for solid dopant materials8US 10,957,509 B1APPLIED Materials.Inc. · 2021
- Method and device for continuous cold plasma deposition of metal coatings7US 7,156,960 B2Cold Plasma Applications, CPA, SPRL · 2007
- Insertable target holder for solid dopant materials6US 11,404,254 B2Varian Semiconductor Equipment Associates, Inc. · 2022
- Plasma processing apparatus and plasma processing method1US 10,233,535 B2Tokyo Electron Limited · 2019