Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target
AssigneeSumitomo Chemical Company, Limited
InventorsMasahiro Fujita, Koji Nishioka
Life of this patent
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Abstract
A sputtering target comprising: a backing plate; and a target material bonded via a bonding material to a bonding region of the backing plate, wherein a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region. The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.
Claims6
A sputtering target comprising:
- a backing plate;
- and
- a target material bonded via a bonding material to a bonding region of the backing plate, wherein
- a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein
- a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.001% or more and 0.6% or less of the area of the bonding region, wherein
- the bonding material is made of metal or alloys having a melting point of 723K or less, and
- the bonding material consists of solder, and the solder is at least one metal selected from the group consisting of indium, tin, lead, silver, bismuth, cadmium, and antimony, or alloys thereof.
Dependencies are inferred from the claim text.