Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target
AssigneeSumitomo Chemical Company, Limited
InventorsMasahiro FUJITA, Koji NISHIOKA
Life of this patent
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Abstract
A sputtering target comprising: a backing plate; and a target material bonded via a bonding material to a bonding region of the backing plate, wherein a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region. The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.
Claims15
A sputtering target comprising:
- a backing plate;
- and
- a target material bonded via a bonding material to a bonding region of the backing plate, wherein
- a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein
- a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region, wherein
- the bonding material is made of metal or alloys having a melting point of 723K or less.
A method of bonding a target material and a backing plate with a bonding material, comprising the steps of:
- applying the bonding material to a bonding region to be bonded to the target material on a principal surface of the backing plate;
- sliding and moving the target material in a first direction along the principal surface of the backing plate so that an edge of the target material is moved from a first edge side of the bonding region of the backing plate to a position beyond a second edge facing the first edge in the first direction in the bonding region of the backing plate;
- and
- sliding and moving the target material in a second direction opposite to the first direction along the principal surface of the backing plate to match the target material with the bonding region of the backing plate.
Dependencies are inferred from the claim text.