H01J 2237/31
Processing objects on a macro-scale
H01J2237/31 (Processing objects on a macro-scale) appears on 543 US grants and 604 published applications in this corpus.
Search patents in H01J- Granted patents
- 543
- Published applications
- 604
- Assignees
- 317
- Inventors
- 1,275
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 9 | 0 |
| 1998 | 13 | 0 |
| 1999 | 7 | 0 |
| 2000 | 16 | 0 |
| 2001 | 13 | 7 |
| 2002 | 10 | 10 |
| 2003 | 9 | 10 |
| 2004 | 13 | 23 |
| 2005 | 9 | 27 |
| 2006 | 18 | 20 |
| 2007 | 13 | 16 |
| 2008 | 12 | 28 |
| 2009 | 18 | 25 |
| 2010 | 15 | 29 |
| 2011 | 10 | 21 |
| 2012 | 21 | 28 |
| 2013 | 26 | 25 |
| 2014 | 17 | 23 |
| 2015 | 17 | 24 |
| 2016 | 20 | 28 |
| 2017 | 30 | 39 |
| 2018 | 24 | 22 |
| 2019 | 30 | 27 |
| 2020 | 33 | 27 |
| 2021 | 10 | 29 |
| 2022 | 17 | 31 |
| 2023 | 22 | 29 |
| 2024 | 25 | 21 |
| 2025 | 30 | 19 |
| 2026 | 6 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01J 2237/3151EtchingIndexing code159
- H01J 2237/3132EvaporatingIndexing code79
- H01J 2237/3142Ion platingIndexing code73
- H01J 2237/3114MachiningIndexing code53
- H01J 2237/316Changing physical propertiesIndexing code46
- H01J 2237/3165Changing chemical propertiesIndexing code44
- H01J 2237/3128MeltingIndexing code38
- H01J 2237/3104WeldingIndexing code22
Recent patents
- Electron beam curing of clear and pigmented coatings for the coil industry and method thereof25 Aug 2026US 12,719,016 B2Energy Sciences Inc.
- Controlling etch angles by substrate rotation in angled etch tools30 Jun 2026US 12,669,635 B2APPLIED Materials.Inc.
- Apparatus and methods for beam processing of substrates2 Jun 2026US 12,645,144 B2Tokyo Electron Limited
- Sample holder, loading device, and method for inserting a sample into a sample holder21 Apr 2026US 12,609,267 B2Leica Microsystems CMS GmbH
- Wafer total thickness variation using maskless implant10 Feb 2026US 12,550,686 B2APPLIED Materials.Inc.
- Charged Particle Beam Apparatus and Sample Processing Method27 Aug 2026US 2026/0255914 A1Hitachi High-Tech Corporation
- Apparatus and techniques for substrate processing using independent ion source and radical source13 Aug 2026US 2026/0237601 A1APPLIED Materials.Inc.
- Semiconductor manufacturing apparatus including reflector2 Jul 2026US 2026/0188604 A1Samsung Electronics Co., Ltd.
- Battery state control during cross-section beam milling18 Jun 2026US 2026/0171345 A1FEI Company
- Charged particle beam device and method for controlling charged particle beam device18 Jun 2026US 2026/0171354 A1Hitachi High-Tech Science Corporation
Most cited
By later US patents
- Neutral beam-assisted atomic layer chemical vapor deposition apparatus and method of processing substrate using the same425US 7,799,706 B2Sungkyunkwan University Foundation for Corporate Collaboration · 2010
- Method and apparatus for in situ anneal during ion implant283US 6,111,260 AAdvanced Micro Devices, Inc. · 2000
- Mask for increased uniformity in ion beam deposition148US 8,308,921 B1Western Digital (Fremont), LLC · 2012
- Method for sample separation and lift-out with one cut131US 6,420,722 B2Omniprobe, Inc. · 2002
- Method for anisotropic etching conductive film100US 5,719,068 ASemiconductor Energy Laboratory Co.Ltd. · 1998