H01J 2237/3132
Evaporating
H01J2237/3132 (Evaporating) appears on 79 US grants and 79 published applications in this corpus.
Search patents in H01J- Granted patents
- 79
- Published applications
- 79
- Assignees
- 72
- Inventors
- 227
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 2 |
| 2002 | 2 | 2 |
| 2003 | 2 | 1 |
| 2004 | 1 | 3 |
| 2005 | 1 | 4 |
| 2006 | 4 | 2 |
| 2007 | 1 | 3 |
| 2008 | 0 | 1 |
| 2009 | 2 | 2 |
| 2010 | 2 | 7 |
| 2011 | 0 | 6 |
| 2012 | 2 | 3 |
| 2013 | 3 | 4 |
| 2014 | 3 | 0 |
| 2015 | 4 | 3 |
| 2016 | 1 | 1 |
| 2017 | 3 | 6 |
| 2018 | 4 | 3 |
| 2019 | 3 | 4 |
| 2020 | 2 | 4 |
| 2021 | 2 | 5 |
| 2022 | 0 | 2 |
| 2023 | 2 | 4 |
| 2024 | 3 | 4 |
| 2025 | 4 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus and methods for beam processing of substrates2 Jun 2026US 12,645,144 B2Tokyo Electron Limited
- Apparatus and method for depositing hard carbon layers15 Jul 2025US 12,362,141 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Method for depositing target material in deposition chamber with tiltable workpiece holder24 Jun 2025US 12,341,042 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Crucible cover for coating with an electron beam source25 Mar 2025US 12,258,659 B2Ferrotec (USA) Corporation
- Forming method of plasma resistant oxyfluoride coating layer25 Feb 2025US 12,237,153 B2Korea Institute of Ceramic Engineering and Technology
- Plasma Electron Beam Installation System11 Dec 2025US 2025/0379027 A1
- Electron beam device for surface treatment16 Oct 2025US 2025/0323006 A1
- Method for depositing target material in deposition chamber with tiltable workpiece holder18 Sep 2025US 2025/0293064 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and methods for beam processing of substrates19 Dec 2024US 2024/0419080 A1Tokyo Electron Limited
- Power polishing apparatuses and methods for in-situ finishing and coating of optical component23 May 2024US 2024/0167150 A1Edmund Optics, Inc.
Most cited
By later US patents
- Method for anisotropic etching conductive film100US 5,719,068 ASemiconductor Energy Laboratory Co.Ltd. · 1998
- Apparatus for coating substrates61US 5,656,141 ALeybold Aktiengesellschaft · 1997
- Process and apparatus for the production of a metal oxide layer49US 5,618,575 ABalzers Aktiengesellschaft · 1997
- Electron jet vapor deposition system40US 5,571,332 AJet Process Corporation · 1996
- Apparatus for plasma-assisted high rate electron beam vaporization21US 5,635,087 AFraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e. V. · 1997