Method for anisotropic etching conductive film
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHideomi Suzawa, Shunpei Yamazaki, Yasuhiko Takemura
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHideomi Suzawa, Shunpei Yamazaki, Yasuhiko Takemura
Estimating the term…
In producing a semiconductor device having GOLD structure, a conductive film containing mainly silicon, tungsten, or/and molybdenum is etched by anisotropic etching using halogen fluoride (such as ClF, ClF.sub.3, BrF, BrF.sub.3, IF, and IF.sub.3) as an etching gas, without producing plasma. In this anisotropic etching, a chamber is maintained to obtain a high vacuum state. Molecular beams of halogen fluoride generated by an evaporator is irradiated into the substrate in a vertical direction (right angle) substantially to the substrate, in order to increase the degree of vertical etching to the substrate than that of horizontal etching. The halogen fluoride are excited by using the RF coil and the RF power source to promote etching.
An anisotropic etching method comprising the steps of:
An etching method comprising the step of anisotropically etching a conductive film by using a halogen fluoride as an etching gas, wherein the anisotropic etching step including the steps of,
An etching method comprising the steps of:
An etching method comprising the steps of:
A method of manufacturing a semiconductor device comprising the steps of:
Dependencies are inferred from the claim text.