G01R 1/07364
With provisions for altering position, number or connection of probe tips
Official title: {with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch}
G01R1/07364 (With provisions for altering position, number or connection of probe tips) appears on 1,212 US grants and 1,373 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,212
- Published applications
- 1,373
- Assignees
- 374
- Inventors
- 2,083
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 8 | 0 |
| 1987 | 6 | 0 |
| 1988 | 13 | 0 |
| 1989 | 13 | 0 |
| 1990 | 13 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 14 | 0 |
| 1997 | 8 | 0 |
| 1998 | 21 | 0 |
| 1999 | 21 | 0 |
| 2000 | 17 | 0 |
| 2001 | 25 | 17 |
| 2002 | 34 | 37 |
| 2003 | 36 | 38 |
| 2004 | 38 | 52 |
| 2005 | 42 | 45 |
| 2006 | 40 | 56 |
| 2007 | 32 | 51 |
| 2008 | 41 | 97 |
| 2009 | 34 | 54 |
| 2010 | 46 | 49 |
| 2011 | 38 | 40 |
| 2012 | 31 | 41 |
| 2013 | 26 | 36 |
| 2014 | 37 | 45 |
| 2015 | 41 | 56 |
| 2016 | 41 | 30 |
| 2017 | 47 | 62 |
| 2018 | 47 | 45 |
| 2019 | 50 | 70 |
| 2020 | 56 | 65 |
| 2021 | 64 | 52 |
| 2022 | 38 | 47 |
| 2023 | 42 | 57 |
| 2024 | 51 | 49 |
| 2025 | 40 | 46 |
| 2026 | 24 | 136 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Probe assembly with downward-protruding probe shield and methods of operating the same29 Sep 2026US 12,748,131 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for loopback testing and methods of forming the same22 Sep 2026US 12,742,795 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe card device having expansion configuration and probe head thereof8 Sep 2026US 12,730,129 B2Chunghwa Precision Test Tech. Co., Ltd.
- Testing equipment and adapter1 Sep 2026US 12,724,039 B2Nanya Technology Corporation
- Multi-prober cartridge8 Oct 2026US 2026/0309750 A1Korea Institute of Industrial Technology
- Conductive probing interface device8 Oct 2026US 2026/0309775 A1International Business Machines Corporation
- Probe head with an improved configuration24 Sep 2026US 2026/0287615 A1Technoprobe S.P.A.
- Probe support assembly including a piezoelectric sensor array for alignment of a probe card assembly and methods of operating and forming the same27 Aug 2026US 2026/0251704 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for testing an electronic device20 Aug 2026US 2026/0243803 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Contact carriers (tiles) for populating larger substrates with spring contacts304US 5,806,181 AFormFactor, Inc. · 1998
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998