G01R 1/07385
Using switching of signals between probe tips and test bed, i.e. the
Official title: {using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester}
G01R1/07385 (Using switching of signals between probe tips and test bed, i.e. the) appears on 69 US grants and 64 published applications in this corpus.
Search patents in G01R- Granted patents
- 69
- Published applications
- 64
- Assignees
- 45
- Inventors
- 148
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 8 | 4 |
| 2003 | 2 | 3 |
| 2004 | 2 | 5 |
| 2005 | 6 | 7 |
| 2006 | 2 | 2 |
| 2007 | 4 | 5 |
| 2008 | 0 | 6 |
| 2009 | 3 | 1 |
| 2010 | 2 | 5 |
| 2011 | 3 | 2 |
| 2012 | 1 | 1 |
| 2013 | 0 | 2 |
| 2014 | 2 | 1 |
| 2015 | 2 | 2 |
| 2016 | 4 | 1 |
| 2017 | 2 | 0 |
| 2018 | 0 | 2 |
| 2019 | 2 | 3 |
| 2020 | 2 | 1 |
| 2021 | 1 | 1 |
| 2022 | 0 | 2 |
| 2023 | 2 | 4 |
| 2024 | 2 | 1 |
| 2025 | 2 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
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- Chip testing device and chip testing method13 Nov 2025US 2025/0347717 A1Contemporary Amperex Technology Co., Limited
- Wafer inspection apparatus25 Sep 2025US 2025/0298057 A1Chroma Ate Inc.
- Apparatuses and methods for testing semiconductor circuitry using microelectromechanical systems switches5 Dec 2024US 2024/0402239 A1Analog Devices International Unlimited Company
- Test apparatus and jumper thereof20 Apr 2023US 2023/0123340 A1Star Technologies Inc.
- Wafer inspection method and inspection apparatus6 Apr 2023US 2023/0105061 A1Chroma Ate Inc.
Most cited
By later US patents
- Apparatus and method for testing semiconductor devices formed on a semiconductor wafer165US 6,124,725 ATokyo Electron Limited · 2000
- Compound switching matrix for probing and interconnecting devices under test to measurement equipment152US 6,100,815 AElectro Scientific Industries, Inc. · 2000
- Semiconductor wafer test and burn-in112US 5,600,257 AInternational Business Machines Corporation · 1997
- Probe card cooling assembly with direct cooling of active electronic components97US 6,891,385 B2FormFactor, Inc. · 2005
- Probe apparatus with RC circuit connected between ground and a guard96US 5,903,143 AHewlett-Packard Company · 1999