G01R 1/073
Multiple probes
G01R1/073 (Multiple probes) appears on 4,088 US grants and 3,873 published applications in this corpus.
Search patents in G01R- Granted patents
- 4,088
- Published applications
- 3,873
- Assignees
- 1,030
- Inventors
- 5,917
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 11 | 0 |
| 1978 | 9 | 0 |
| 1979 | 10 | 0 |
| 1980 | 11 | 0 |
| 1981 | 9 | 0 |
| 1982 | 14 | 0 |
| 1983 | 11 | 0 |
| 1984 | 9 | 0 |
| 1985 | 21 | 0 |
| 1986 | 36 | 0 |
| 1987 | 33 | 0 |
| 1988 | 41 | 0 |
| 1989 | 51 | 0 |
| 1990 | 57 | 0 |
| 1991 | 28 | 0 |
| 1992 | 42 | 0 |
| 1993 | 33 | 0 |
| 1994 | 48 | 0 |
| 1995 | 71 | 0 |
| 1996 | 84 | 0 |
| 1997 | 78 | 0 |
| 1998 | 76 | 0 |
| 1999 | 95 | 0 |
| 2000 | 90 | 0 |
| 2001 | 116 | 62 |
| 2002 | 123 | 133 |
| 2003 | 120 | 127 |
| 2004 | 118 | 167 |
| 2005 | 138 | 191 |
| 2006 | 145 | 191 |
| 2007 | 128 | 184 |
| 2008 | 149 | 241 |
| 2009 | 131 | 167 |
| 2010 | 149 | 132 |
| 2011 | 105 | 100 |
| 2012 | 84 | 95 |
| 2013 | 65 | 100 |
| 2014 | 86 | 119 |
| 2015 | 103 | 136 |
| 2016 | 113 | 82 |
| 2017 | 105 | 129 |
| 2018 | 105 | 115 |
| 2019 | 117 | 163 |
| 2020 | 142 | 177 |
| 2021 | 159 | 155 |
| 2022 | 136 | 151 |
| 2023 | 117 | 158 |
| 2024 | 145 | 184 |
| 2025 | 117 | 174 |
| 2026 | 94 | 240 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Charge/discharge inspection device and charge/discharge inspection equipment6 Oct 2026US 12,754,239 B2Nippon Steel Texeng. Co., Ltd.
- Electrical connecting device and method for manufacturing electrical connecting device29 Sep 2026US 12,748,130 B2Kabushiki Kaisha Nihon Micronics
- Probe assembly with downward-protruding probe shield and methods of operating the same29 Sep 2026US 12,748,131 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for loopback testing and methods of forming the same22 Sep 2026US 12,742,795 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-prober cartridge8 Oct 2026US 2026/0309750 A1Korea Institute of Industrial Technology
- Conductive probing interface device8 Oct 2026US 2026/0309775 A1International Business Machines Corporation
- Probe head with contact probes having an improved configuration1 Oct 2026US 2026/0298977 A1Technoprobe S.P.A.
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Composite interface substrate for a probe card and methods for forming and operating the same1 Oct 2026US 2026/0299017 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999