G01R 1/02
General constructional details
G01R1/02 (General constructional details) appears on 10,516 US grants and 9,379 published applications in this corpus.
Search patents in G01R- Granted patents
- 10,516
- Published applications
- 9,379
- Assignees
- 2,666
- Inventors
- 15,791
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 30 | 0 |
| 1977 | 39 | 0 |
| 1978 | 32 | 0 |
| 1979 | 29 | 0 |
| 1980 | 34 | 0 |
| 1981 | 21 | 0 |
| 1982 | 31 | 0 |
| 1983 | 31 | 0 |
| 1984 | 27 | 0 |
| 1985 | 46 | 0 |
| 1986 | 58 | 0 |
| 1987 | 72 | 0 |
| 1988 | 88 | 0 |
| 1989 | 140 | 0 |
| 1990 | 128 | 0 |
| 1991 | 119 | 0 |
| 1992 | 121 | 0 |
| 1993 | 116 | 0 |
| 1994 | 105 | 0 |
| 1995 | 159 | 0 |
| 1996 | 195 | 0 |
| 1997 | 180 | 0 |
| 1998 | 193 | 0 |
| 1999 | 214 | 0 |
| 2000 | 247 | 0 |
| 2001 | 299 | 144 |
| 2002 | 357 | 316 |
| 2003 | 305 | 342 |
| 2004 | 295 | 360 |
| 2005 | 313 | 401 |
| 2006 | 348 | 416 |
| 2007 | 325 | 382 |
| 2008 | 292 | 478 |
| 2009 | 290 | 357 |
| 2010 | 336 | 335 |
| 2011 | 268 | 289 |
| 2012 | 201 | 257 |
| 2013 | 205 | 325 |
| 2014 | 242 | 369 |
| 2015 | 316 | 414 |
| 2016 | 333 | 312 |
| 2017 | 344 | 332 |
| 2018 | 337 | 334 |
| 2019 | 349 | 393 |
| 2020 | 371 | 390 |
| 2021 | 386 | 409 |
| 2022 | 348 | 366 |
| 2023 | 328 | 404 |
| 2024 | 335 | 436 |
| 2025 | 309 | 379 |
| 2026 | 229 | 439 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Shielded fine-pitch high-performance impedance tunable interconnect6 Oct 2026US 12,754,209 B2Intel Corporation
- Probe head including a probe supported by a tapered hole6 Oct 2026US 12,754,210 B2Yokowo Co., Ltd.
- Current sensor6 Oct 2026US 12,754,216 B2Schaeffler Technologies AG & Co. KG
- Charge/discharge inspection device and charge/discharge inspection equipment6 Oct 2026US 12,754,239 B2Nippon Steel Texeng. Co., Ltd.
- Fixture device, testing system, and positioning rod for integrated circuit substrate testing8 Oct 2026US 2026/0309747 A1Mpi Corporation
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Multi-prober cartridge8 Oct 2026US 2026/0309750 A1Korea Institute of Industrial Technology
- Low cost, high accuracy & standards compliant isolation parameter test system and method for semiconductor devices8 Oct 2026US 2026/0309765 A1
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Signal processing appparatus and methods797US 5,335,277 AThe Personalized Mass Media Corporation · 1994
- Signal processing apparatus and methods615US 4,965,825 AThe Personalized Mass Media Corporation · 1990
- Signal processing apparatus and methods470US 5,233,654 AThe Personalized Mass Media Corporation · 1993
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998