G01R 1/04
Housings
Official title: Housings; Supporting members; Arrangements of terminals
G01R1/04 (Housings) appears on 4,217 US grants and 3,753 published applications in this corpus.
Search patents in G01R- Granted patents
- 4,217
- Published applications
- 3,753
- Assignees
- 1,406
- Inventors
- 7,326
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 6 | 0 |
| 1978 | 9 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 4 | 0 |
| 1985 | 12 | 0 |
| 1986 | 9 | 0 |
| 1987 | 23 | 0 |
| 1988 | 18 | 0 |
| 1989 | 47 | 0 |
| 1990 | 32 | 0 |
| 1991 | 44 | 0 |
| 1992 | 43 | 0 |
| 1993 | 48 | 0 |
| 1994 | 39 | 0 |
| 1995 | 55 | 0 |
| 1996 | 83 | 0 |
| 1997 | 80 | 0 |
| 1998 | 79 | 0 |
| 1999 | 85 | 0 |
| 2000 | 118 | 0 |
| 2001 | 144 | 65 |
| 2002 | 168 | 133 |
| 2003 | 143 | 147 |
| 2004 | 119 | 149 |
| 2005 | 140 | 158 |
| 2006 | 138 | 145 |
| 2007 | 126 | 124 |
| 2008 | 89 | 124 |
| 2009 | 99 | 114 |
| 2010 | 106 | 112 |
| 2011 | 93 | 104 |
| 2012 | 61 | 103 |
| 2013 | 74 | 131 |
| 2014 | 79 | 140 |
| 2015 | 129 | 184 |
| 2016 | 149 | 157 |
| 2017 | 150 | 157 |
| 2018 | 148 | 143 |
| 2019 | 163 | 176 |
| 2020 | 172 | 171 |
| 2021 | 180 | 195 |
| 2022 | 155 | 161 |
| 2023 | 154 | 174 |
| 2024 | 141 | 174 |
| 2025 | 140 | 167 |
| 2026 | 88 | 145 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Shielded fine-pitch high-performance impedance tunable interconnect6 Oct 2026US 12,754,209 B2Intel Corporation
- Current sensor6 Oct 2026US 12,754,216 B2Schaeffler Technologies AG & Co. KG
- Testing apparatus for high-rate transmission and reception of signals between device under test and semiconductor testing apparatus29 Sep 2026US 12,748,144 B2Advantest Corporation
- Semiconductor test device and semiconductor test system22 Sep 2026US 12,742,794 B2Olum Material Corporation
- Fixture device, testing system, and positioning rod for integrated circuit substrate testing8 Oct 2026US 2026/0309747 A1Mpi Corporation
- Low cost, high accuracy & standards compliant isolation parameter test system and method for semiconductor devices8 Oct 2026US 2026/0309765 A1
- Electric testing systems8 Oct 2026US 2026/0309779 A1
- Battery test bench and system for testing batteries1 Oct 2026US 2026/0298973 A1ZF Friedrichshafen AG
- Inspection member1 Oct 2026US 2026/0298974 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998