G01R 1/0408
Test fixtures or contact fields
Official title: {Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808)}
G01R1/0408 (Test fixtures or contact fields) appears on 3,587 US grants and 3,276 published applications in this corpus.
Search patents in G01R- Granted patents
- 3,587
- Published applications
- 3,276
- Assignees
- 1,136
- Inventors
- 5,933
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 6 | 0 |
| 1984 | 2 | 0 |
| 1985 | 8 | 0 |
| 1986 | 7 | 0 |
| 1987 | 18 | 0 |
| 1988 | 10 | 0 |
| 1989 | 31 | 0 |
| 1990 | 20 | 0 |
| 1991 | 24 | 0 |
| 1992 | 31 | 0 |
| 1993 | 30 | 0 |
| 1994 | 32 | 0 |
| 1995 | 44 | 0 |
| 1996 | 66 | 0 |
| 1997 | 52 | 0 |
| 1998 | 58 | 0 |
| 1999 | 63 | 0 |
| 2000 | 100 | 0 |
| 2001 | 132 | 61 |
| 2002 | 159 | 123 |
| 2003 | 133 | 141 |
| 2004 | 113 | 137 |
| 2005 | 132 | 145 |
| 2006 | 133 | 135 |
| 2007 | 114 | 112 |
| 2008 | 83 | 110 |
| 2009 | 87 | 98 |
| 2010 | 95 | 105 |
| 2011 | 85 | 96 |
| 2012 | 55 | 91 |
| 2013 | 69 | 115 |
| 2014 | 68 | 117 |
| 2015 | 112 | 154 |
| 2016 | 126 | 131 |
| 2017 | 128 | 134 |
| 2018 | 122 | 122 |
| 2019 | 136 | 149 |
| 2020 | 138 | 147 |
| 2021 | 164 | 167 |
| 2022 | 139 | 138 |
| 2023 | 133 | 153 |
| 2024 | 113 | 138 |
| 2025 | 120 | 136 |
| 2026 | 74 | 121 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Shielded fine-pitch high-performance impedance tunable interconnect6 Oct 2026US 12,754,209 B2Intel Corporation
- Current sensor6 Oct 2026US 12,754,216 B2Schaeffler Technologies AG & Co. KG
- Testing apparatus for high-rate transmission and reception of signals between device under test and semiconductor testing apparatus29 Sep 2026US 12,748,144 B2Advantest Corporation
- Semiconductor test device and semiconductor test system22 Sep 2026US 12,742,794 B2Olum Material Corporation
- Fixture device, testing system, and positioning rod for integrated circuit substrate testing8 Oct 2026US 2026/0309747 A1Mpi Corporation
- Low cost, high accuracy & standards compliant isolation parameter test system and method for semiconductor devices8 Oct 2026US 2026/0309765 A1
- Battery test bench and system for testing batteries1 Oct 2026US 2026/0298973 A1ZF Friedrichshafen AG
- Inspection member1 Oct 2026US 2026/0298974 A1Samsung Electronics Co., Ltd.
- Testing apparatus and method of using the same1 Oct 2026US 2026/0298975 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998