G01R 1/0491
For testing integrated circuits on wafers
Official title: {for testing integrated circuits on wafers, e.g. wafer-level test cartridge}
G01R1/0491 (For testing integrated circuits on wafers) appears on 250 US grants and 292 published applications in this corpus.
Search patents in G01R- Granted patents
- 250
- Published applications
- 292
- Assignees
- 120
- Inventors
- 504
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 6 |
| 2003 | 5 | 4 |
| 2004 | 3 | 7 |
| 2005 | 2 | 10 |
| 2006 | 12 | 9 |
| 2007 | 8 | 5 |
| 2008 | 6 | 11 |
| 2009 | 7 | 7 |
| 2010 | 8 | 11 |
| 2011 | 6 | 8 |
| 2012 | 4 | 7 |
| 2013 | 8 | 11 |
| 2014 | 8 | 9 |
| 2015 | 10 | 18 |
| 2016 | 11 | 9 |
| 2017 | 12 | 18 |
| 2018 | 11 | 9 |
| 2019 | 12 | 14 |
| 2020 | 12 | 23 |
| 2021 | 23 | 20 |
| 2022 | 11 | 13 |
| 2023 | 20 | 14 |
| 2024 | 11 | 18 |
| 2025 | 10 | 17 |
| 2026 | 8 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Replaceable insulator collars for semiconductor test systems18 Aug 2026US 12,710,448 B2Xcerra Corporation
- Testing module and testing method using the same11 Aug 2026US 12,704,541 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe head for wafer-level burn-in test (WLBI) and probe card comprising said probe head9 Jun 2026US 12,650,445 B2Microtest S.p.A.
- Method of having good thermal isolation in wafer test cassette26 May 2026US 12,638,497 B2Xingr Technologies (Zhejiang) Limited
- Alignment chip for probe card, probe card and probe card repair method7 Apr 2026US 12,596,147 B2Japan Electronic Materials Corporation
- Method and system for thermal control of devices in an electronics tester17 Sep 2026US 2026/0276734 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251698 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251699 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251700 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251701 A1Aehr Test Systems
Most cited
By later US patents
- Micromachined probe card having compliant contact members for testing semiconductor wafers176US 5,869,974 AMicron Technology, Inc. · 1999
- Fine pitch contact device employing a compliant conductive polymer bump141US 6,064,217 AEPI Technologies, Inc. · 2000
- Wafer-level burn-in and test cartridge132US 6,340,895 B12002
- Contactless interfacing of test signals with a device under test131US 7,928,750 B2FormFactor, Inc. · 2011
- Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method98US 5,945,834 AMatsushita Electric Industrial Co., Ltd. · 1999