Micromachined probe card having compliant contact members for testing semiconductor wafers

A probe card for testing a semiconductor wafer comprising:

• a substrate comprising a contact member configured to make a temporary electrical connection with a die on the wafer;
• a cavity in the substrate proximate to the contact member forming a flexible segment of the substrate configured to permit flexure of the contact member;
• and
• a passageway formed in the substrate in flow communication with the cavity, the passageway configured for introducing a pressure into the cavity for controlling the flexure of the contact member.

A probe card for testing a semiconductor wafer comprising:

• a substrate comprising a raised contact member having a surface and a projection extending from the surface, the projection dimensioned to penetrate into a pad on the wafer to a depth less than a thickness of the pad while the surface limits further penetration and maintains a spacing between the wafer and the substrate;
• a cavity formed in the substrate proximate to the contact member, the cavity forming a flexible membrane dimensioned to permit flexure of the contact member during a test procedure;
• and
• a passageway in the substrate to the cavity, the passageway configured for flow communication with a fluid or gas supply for introducing a pressure in the cavity and controlling a compliancy of the contact member.

A probe card for testing a semiconductor wafer comprising:

• a support member configured for mounting to a wafer probe apparatus, the support member comprising a plurality of first conductors configured for electrical contact by electrical pins of the apparatus;
• a substrate mounted to the support member;
• a plurality of contact members on the substrate configured to electrically engage pads on the wafer, each contact member comprising a raised surface and at least one projection thereon configured to penetrate a pad on the wafer while the surface limits further penetration and spaces the wafer and the substrate;
• a plurality of second conductors on the substrate in electrical communication with the first conductors and with the contact members;
• a cavity and a flexible membrane formed in the substrate proximate to the contact members to permit flexure of the contact members during a test procedure;
• and
• a passageway in the substrate to the cavity, the passageway configured for flow communication with a fluid or gas supply for introducing a pressure in the cavity and controlling a compliancy of the contact members.