Alignment chip for probe card, probe card and probe card repair method
AssigneeJapan Electronic Materials Corporation
InventorTakashi Yoshida
Life of this patent
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Abstract
An object is to provide an alignment chip for forming an alignment symbol on a wiring board of a probe card. Provided are: a substrate 51 having a pasting surface to be pasted to a probe installation surface 17 of a wiring board 14 constituting a probe card 10 via an adhesive 54; and an alignment symbol 501 made of a metal film 52 formed on a symbol surface on a side opposite to the pasting surface of the substrate 51. The symbol surface includes a symbol peripheral region 502 surrounding the alignment symbol 501, and the symbol peripheral region 502 has a lower reflectance than the alignment symbol 501.
Claims8
A chip to be pasted to a surface of a wiring board of a probe card, comprising:
- a chip-shaped base member;
- a metal member formed directly on a portion of a surface of the chip-shaped base member, the metal member having a planar shape corresponding to a symbol for alignment of the probe card;
- and
- a resin member formed directly on a remaining portion of a same layer as the metal member on the surface of the chip-shaped base member, the resin member having a lower reflectance than the metal member, wherein
- a back surface of the chip-shaped base member is to be pasted to the surface of the wiring board of the probe card.
A probe card, comprising:
- a wiring board having a surface on which an electrode pad is formed;
- a probe attached to the electrode pad;
- and
- a chip pasted to the surface of the wiring board, wherein
- the chip includes a chip-shaped base member and a metal member formed directly on a portion of a surface of the chip-shaped base member, the metal member having a planar shape corresponding to a symbol for alignment of the probe card, and a resin member formed directly on a remaining portion of a same layer as the metal member on the surface of the chip-shaped base member, the resin member having a lower reflectance than the metal member.
Dependencies are inferred from the claim text.