G01R 1/0433
Sockets for ic's or transistors
Official title: {Sockets for IC's or transistors}
G01R1/0433 (Sockets for ic's or transistors) appears on 2,159 US grants and 1,889 published applications in this corpus.
Search patents in G01R- Granted patents
- 2,159
- Published applications
- 1,889
- Assignees
- 610
- Inventors
- 3,155
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 17 | 0 |
| 1990 | 14 | 0 |
| 1991 | 15 | 0 |
| 1992 | 19 | 0 |
| 1993 | 19 | 0 |
| 1994 | 25 | 0 |
| 1995 | 32 | 0 |
| 1996 | 49 | 0 |
| 1997 | 41 | 0 |
| 1998 | 41 | 0 |
| 1999 | 45 | 0 |
| 2000 | 61 | 0 |
| 2001 | 96 | 45 |
| 2002 | 113 | 90 |
| 2003 | 94 | 97 |
| 2004 | 84 | 95 |
| 2005 | 91 | 102 |
| 2006 | 100 | 96 |
| 2007 | 78 | 82 |
| 2008 | 52 | 71 |
| 2009 | 63 | 68 |
| 2010 | 64 | 69 |
| 2011 | 65 | 49 |
| 2012 | 26 | 48 |
| 2013 | 37 | 50 |
| 2014 | 26 | 49 |
| 2015 | 47 | 71 |
| 2016 | 54 | 49 |
| 2017 | 51 | 61 |
| 2018 | 61 | 71 |
| 2019 | 69 | 79 |
| 2020 | 68 | 68 |
| 2021 | 77 | 82 |
| 2022 | 74 | 82 |
| 2023 | 84 | 96 |
| 2024 | 64 | 82 |
| 2025 | 70 | 67 |
| 2026 | 40 | 70 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic, probe guiding member, probe card and socket for package inspection6 Oct 2026US 12,753,124 B2Ferrotec Material Technologies Corporation
- Shielded fine-pitch high-performance impedance tunable interconnect6 Oct 2026US 12,754,209 B2Intel Corporation
- Semiconductor test device and semiconductor test system22 Sep 2026US 12,742,794 B2Olum Material Corporation
- Test socket for 224GBPS ultra-high-speed coaxial testing15 Sep 2026US 12,736,559 B2Solaris Nanofab Ltd.
- Insert inserted to tray for transporting semiconductor products, tray including the insert, and semiconductor product test system including the insert15 Sep 2026US 12,736,581 B2Ateco Inc.
- Fixture device, testing system, and positioning rod for integrated circuit substrate testing8 Oct 2026US 2026/0309747 A1Mpi Corporation
- Inspection member1 Oct 2026US 2026/0298974 A1Samsung Electronics Co., Ltd.
- Testing apparatus and method of using the same1 Oct 2026US 2026/0298975 A1Taiwan Semiconductor Manufacturing Company.Ltd
- High temperature and high current non-zero insertion force spring contact receptacle for dut sockets1 Oct 2026US 2026/0298976 A1
- Test device1 Oct 2026US 2026/0298993 A1Leeno Industrial Inc.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Non-destructive burn-in test socket for integrated circuit die244US 5,123,850 ATexas Instruments Incorporated · 1992