High temperature and high current non-zero insertion force spring contact receptacle for dut sockets

A test socket assembly for use in testing a packaged integrated circuit device having a plurality of pins extending therefrom, the test socket assembly comprising:

• a first member for receiving an integrated circuit test package and having a plurality of openings configured to receive pins extending from the test package;
• a second member stacked below the first member;
• a third member stacked below the second member;
• a plurality of one-piece spring contact receptacles, wherein each of the one-piece spring contact receptacles is positioned in the second member under an opening of the first member to receive a pin extending from the test package;
• a plurality of compression springs, wherein each of the one-piece spring contact receptacles is positioned over at least one compression spring, and wherein each of the compression springs is positioned in the third member;
• and
• wherein the test socket assembly can operate reliably at temperatures greater than 350° C and at test currents greater than 1 amp DC per pin.