G01R 1/0441
Details
Official title: {Details}
G01R1/0441 (Details) appears on 1,337 US grants and 1,360 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,337
- Published applications
- 1,360
- Assignees
- 435
- Inventors
- 2,129
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 15 | 0 |
| 1997 | 16 | 0 |
| 1998 | 12 | 0 |
| 1999 | 22 | 0 |
| 2000 | 26 | 0 |
| 2001 | 42 | 17 |
| 2002 | 45 | 34 |
| 2003 | 43 | 50 |
| 2004 | 43 | 50 |
| 2005 | 50 | 55 |
| 2006 | 57 | 56 |
| 2007 | 51 | 52 |
| 2008 | 30 | 43 |
| 2009 | 35 | 52 |
| 2010 | 48 | 53 |
| 2011 | 50 | 35 |
| 2012 | 21 | 35 |
| 2013 | 31 | 42 |
| 2014 | 14 | 36 |
| 2015 | 39 | 61 |
| 2016 | 43 | 37 |
| 2017 | 44 | 43 |
| 2018 | 42 | 48 |
| 2019 | 51 | 65 |
| 2020 | 55 | 58 |
| 2021 | 68 | 76 |
| 2022 | 62 | 76 |
| 2023 | 74 | 79 |
| 2024 | 59 | 77 |
| 2025 | 65 | 64 |
| 2026 | 34 | 66 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Test socket for 224GBPS ultra-high-speed coaxial testing15 Sep 2026US 12,736,559 B2Solaris Nanofab Ltd.
- Device handling apparatus and device testing apparatus15 Sep 2026US 12,736,582 B2Advantest Corporation
- Low profile electronic testing system with flexible test PCB format25 Aug 2026US 12,716,913 B2Modus Test, LLC
- Contact pin and test socket having the same25 Aug 2026US 12,716,914 B2LST Corporation
- Socket for testing semiconductor device18 Aug 2026US 12,710,446 B2Samsung Electronics Co., Ltd.
- Fixture device, testing system, and positioning rod for integrated circuit substrate testing8 Oct 2026US 2026/0309747 A1Mpi Corporation
- High temperature and high current non-zero insertion force spring contact receptacle for dut sockets1 Oct 2026US 2026/0298976 A1
- Test device1 Oct 2026US 2026/0298993 A1Leeno Industrial Inc.
- Socketed Probes24 Sep 2026US 2026/0287613 A1
- Testing device and method for testing an electronic device17 Sep 2026US 2026/0276701 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999