G01R 1/0458
Related to environmental aspects
Official title: {related to environmental aspects, e.g. temperature}
G01R1/0458 (Related to environmental aspects) appears on 231 US grants and 256 published applications in this corpus.
Search patents in G01R- Granted patents
- 231
- Published applications
- 256
- Assignees
- 129
- Inventors
- 489
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 3 |
| 2003 | 4 | 4 |
| 2004 | 5 | 10 |
| 2005 | 9 | 10 |
| 2006 | 4 | 6 |
| 2007 | 6 | 3 |
| 2008 | 3 | 9 |
| 2009 | 6 | 9 |
| 2010 | 8 | 12 |
| 2011 | 9 | 6 |
| 2012 | 3 | 4 |
| 2013 | 8 | 6 |
| 2014 | 4 | 10 |
| 2015 | 8 | 9 |
| 2016 | 10 | 3 |
| 2017 | 4 | 11 |
| 2018 | 7 | 11 |
| 2019 | 12 | 13 |
| 2020 | 11 | 12 |
| 2021 | 18 | 19 |
| 2022 | 14 | 19 |
| 2023 | 23 | 19 |
| 2024 | 13 | 18 |
| 2025 | 19 | 18 |
| 2026 | 8 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inspection system with thermal interface, and electronic component inspection device and method30 Jun 2026US 12,669,537 B2Chroma Ate Inc.
- Test socket23 Jun 2026US 12,663,437 B2Isc Co., Ltd.
- Semiconductor module inspection device12 May 2026US 12,625,161 B2NTT, Inc.
- Active thermal interposer device with thermal isolation structures5 May 2026US 12,618,896 B2Advantest Test Solutions, Inc.
- Socket board with a socket having heat conductive material disposed on bottom portion of the socket and method for inspecting a semiconductor device mounting in the socket17 Mar 2026US 12,578,358 B2Kioxia Corporation
- Ceramic, probe guide component, probe card, and package test socket20 Aug 2026US 2026/0242292 A1Ferrotec Corporation
- Dynamic test management burn-in device and system18 Jun 2026US 2026/0169058 A1King Yuan Electronics Co., Ltd.
- Semiconductor test apparatus21 May 2026US 2026/0140167 A1Iucf-Hyu (Industry-University Cooperation Foundation Hanyang University)
- Semiconductor package test device using peltier element14 May 2026US 2026/0133244 A1Livingcare Co.,Ltd.
- Active thermal interposer device with thermal isolation structures16 Apr 2026US 2026/0104449 A1Advantest Test Solutions, Inc.
Most cited
By later US patents
- Integrated circuit test fixture and method135US 5,198,753 ADigital Equipment Corporation · 1993
- Wet micro-channel wafer chuck and cooling method106US 5,203,401 ADigital Equipment Corporation · 1993
- Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing71US 4,402,185 ANCR Corporation · 1983
- Ducted test socket66US 7,830,164 B2Honeywell International Inc. · 2010
- Burn-in testing apparatus and method56US 7,042,240 B2Wells-CTI, LLC · 2006