Semiconductor package test device using peltier element
AssigneeLivingcare Co.,Ltd.
InventorsTage Ryul KWON, JunHyun PARK
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Abstract
The present invention relates to a semiconductor package test device using a Peltier element, the device comprising a Peltier chamber unit in which a thermoelectric block located at a lower portion of a first Peltier block comprising a Peltier element comes into contact with an upper portion of a semiconductor package and changes the temperature of the upper portion of the semiconductor package, a socket guide that guides the semiconductor package and is located on a test board, and a pad part on an upper portion of which an electrical connection part coupled to an input/output terminal of a lower portion of the semiconductor package is provided, and which is located on the test board.
Claims5
A semiconductor package test device using Peltier elements, comprising:
- a Peltier chamber unit in which a thermoelectric block located on the underside of a first Peltier block constituted of the Peltier elements comes into contact with top of a semiconductor package to change a temperature on the top of the semiconductor package;
- socket guides located on a test board to guide the semiconductor package;
- and
- a pad part located on the test board and having electrical connectors coupled to input and output terminals on the underside of the semiconductor package,
- wherein the Peltier chamber unit comprises:
- one or more temperature compensation modules located on one side and the other side of a lower portion thereof in such a way as to come into contact with a portion of the test board on the outsides of the socket guides, when the thermoelectric block is coupled with the semiconductor package, to change the temperature of the underside of the semiconductor package;
- and
- a first water cooling jacket located on top of the first Peltier block in such a way as to cool the first Peltier block.
Dependencies are inferred from the claim text.