Socket board with a socket having heat conductive material disposed on bottom portion of the socket and method for inspecting a semiconductor device mounting in the socket

A method for inspecting a semiconductor device, comprising:

• mounting the semiconductor device on a socket of a socket board so that terminals of the semiconductor device are respectively supported by pins of the socket board that penetrate a bottom portion of the socket, and come into contact with a heat conductive material that is disposed on the bottom portion of the socket, wherein the heat conductive material includes a macromolecular gel and electrically-insulating metal-containing particles including at least one of alumina, aluminum nitride, magnesia, and beryllia, added to the macromolecular gel;
• supplying power to the semiconductor device via the pin while the socket board on which the semiconductor device is mounted is maintained at a constant temperature;
• and then
• performing an operation test on the semiconductor device.