Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing

A test socket for an I.C. chip comprising:

• a holder for releasably mounting said chip;
• a base formed of high thermal conductivity material for mounting the holder and for selectively acting as a heat sink or as a heat source;
• at least one thermoelectric module in direct contact with said base;
• and
• a heat conductive block having a base in thermal communication with said thermoelectric module and an upwardly extending portion having a contact surface for receiving said holder such that, upon mounting in said holder, the chip is in thermal communication with said contact surface of the block.

An apparatus for an I.C. chip comprising:

• a socket for releasably mounting said chip;
• a base formed of high thermal conductivity material for mounting the socket and for selectively acting as one of a heat sink or as a heat source;
• at least one primary thermoelectric module in thermal communication with said base;
• a heat conductive pad in thermal communication with said primary thermoelectric module;
• a secondary thermoelectric module in thermal communication with said heat conductive pad;
• and
• a heat conductive block having a base in thermal communication with said secondary thermoelectric module and an upwardly extending portion having a contact surface for receiving said socket such that, upon insertion in the socket, the chip is in thermal communication with the contact surface of the block.